Atomic layer deposition of metals: Precursors and film growth

Atomic Layer Deposition of Nickel Carbide from a Nickel Amidinate Precursor and Hydrogen Plasma

(2018) Qun Guo et al.   ACS Applied Materials & Interfaces

Nanoparticle sintering in atomic layer deposition of supported catalysts: Kinetic modeling of the size distribution

(2018) Fabio Grillo et al.   CATALYSIS TODAY

Diamine Adduct of Cobalt(II) Chloride as a Precursor for Atomic Layer Deposition of Stoichiometric Cobalt(II) Oxide and Reduction Thereof to Cobalt Metal Thin Films

(2018) Katja Väyrynen et al.   CHEMISTRY OF MATERIALS

Atomic Layer Deposition of Aluminum Metal Films Using a Thermally Stable Aluminum Hydride Reducing Agent

(2018) Kyle J. Blakeney et al.   CHEMISTRY OF MATERIALS

Aluminum dihydride complexes and their unexpected application in atomic layer deposition of titanium carbonitride films

(2018) Kyle J. Blakeney et al.   DALTON TRANSACTIONS

Rhenium Metal and Rhenium Nitride Thin Films Grown by Atomic Layer Deposition

(2018) Jani Hämäläinen et al.   ANGEWANDTE CHEMIE-INTERNATIONAL EDITION

A new N-heterocyclic carbene-based silver precursor and its validation in atmospheric pressure plasma enhanced spatial atomic layer deposition of silver thin films

(2018) Nils Boysen et al.   ANGEWANDTE CHEMIE-INTERNATIONAL EDITION

Kinetics of Lifetime Changes in Bimetallic Nanocatalysts Revealed by Quick X-ray Absorption Spectroscopy

(2018) Matthias Filez et al.   ANGEWANDTE CHEMIE-INTERNATIONAL EDITION

Surface chemistry of group 11 atomic layer deposition precursors on silica using solid-state nuclear magnetic resonance spectroscopy

(2017) Peter J. Pallister et al.   JOURNAL OF CHEMICAL PHYSICS

Understanding and Controlling the Aggregative Growth of Platinum Nanoparticles in Atomic Layer Deposition: An Avenue to Size Selection

(2017) Fabio Grillo et al.   Journal of Physical Chemistry Letters

Key role of surface oxidation and reduction processes in the coarsening of Pt nanoparticles

(2017) Eduardo Solano et al.   Nanoscale

Study of Monomeric Copper Complexes Supported by N-Heterocyclic and Acyclic Diamino Carbenes

(2017) Jason P. Coyle et al.   ORGANOMETALLICS

Independent tuning of size and coverage of supported Pt nanoparticles using atomic layer deposition

(2017) Jolien Dendooven et al.   Nature Communications

Island Coalescence during Film Growth: An Underestimated Limitation of Cu ALD

(2017) Dirk J. Hagen et al.   Advanced Materials Interfaces

Prospects for Thermal Atomic Layer Etching Using Sequential, Self-Limiting Fluorination and Ligand-Exchange Reactions

(2016) Steven M. George et al.   ACS Nano

Atomic Layer Deposition Route To Tailor Nanoalloys of Noble and Non-noble Metals

(2016) Ranjith K. Ramachandran et al.   ACS Nano

Metallic Copper Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition of Air Stable Precursors 

(2016) Alexander Sasinska et al.   ADVANCED ENGINEERING MATERIALS

Low Temperature Thermal Atomic Layer Deposition of Cobalt Metal Films

(2016) Joseph P. Klesko et al.   CHEMISTRY OF MATERIALS

The Work Function Behavior of Aluminum-Doped Titanium Carbide Grown by Atomic Layer Deposition

(2016) Jungmin Moon et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Thermal Decomposition of Copper Iminopyrrolidinate Atomic Layer Deposition (ALD) Precursors on Silicon Oxide Surfaces

(2016) Yunxi Yao et al.   Journal of Physical Chemistry C

Ag films grown by remote plasma enhanced atomic layer deposition on different substrates

(2016) Akinwumi A. Amusan et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Tuning Catalytic Selectivity at the Mesoscale via Interparticle Interactions

(2016) Hemma Mistry et al.   ACS Catalysis

Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma

(2015) Zheng Guo et al.   CHEMISTRY OF MATERIALS

Atomic Layer Deposition of Gold Metal

(2015) Matthew B. E. Griffiths et al.   CHEMISTRY OF MATERIALS

Thermal Atomic Layer Deposition of Titanium Films Using Titanium Tetrachloride and 2-Methyl-1,4-bis(trimethylsilyl)-2,5-cyclohexadiene or 1,4-Bis(trimethylsilyl)-1,4-dihydropyrazine

(2015) Joseph P. Klesko et al.   CHEMISTRY OF MATERIALS

Quantum chemical and solution phase evaluation of metallocenes as reducing agents for the prospective atomic layer deposition of copper

(2015) Gangotri Dey et al.   DALTON TRANSACTIONS

Tailoring Precursors for Deposition: Synthesis, Structure, and Thermal Studies of Cyclopentadienylcopper(I) Isocyanide Complexes

(2015) A. M. Willcocks et al.   INORGANIC CHEMISTRY

Thermal chemistry of the Cu-KI5 atomic layer deposition precursor on a copper surface

(2015) Qiang Ma et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Atmospheric pressure plasma enhanced spatial ALD of silver

(2015) Fieke J. van den Bruele et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Overview of atomic layer etching in the semiconductor industry

(2015) Keren J. Kanarik et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Ruthenium and ruthenium dioxide thin films deposited by atomic layer deposition using a novel zero-valent metalorganic precursor, (ethylbenzene)(1,3-butadiene)Ru(0), and molecular oxygen

(2015) Seungmin Yeo et al.   MICROELECTRONIC ENGINEERING

Atomic layer deposition of Pd and Pt nanoparticles for catalysis: on the mechanisms of nanoparticle formation

(2015) Adriaan J M Mackus et al.   NANOTECHNOLOGY

Base-Free and Bisphosphine Ligand Dialkylmanganese(II) Complexes as Precursors for Manganese Metal Deposition

(2015) Jeffrey S. Price et al.   ORGANOMETALLICS

Nanometer-thick copper films grown by thermal atomic layer deposition

(2015) Zhenyu Zhong et al.   THIN SOLID FILMS

Atomic Layer Etching: What Can We Learn from Atomic Layer Deposition?

(2015) T. Faraz et al.   ECS Journal of Solid State Science and Technology

Near room temperature plasma enhanced atomic layer deposition of ruthenium using the RuO4-precursor and H2-plasma

(2015) Matthias M. Minjauw et al.   Journal of Materials Chemistry C

Atomic Layer Deposition of Ruthenium and Ruthenium Oxide Thin Films from a Zero-Valent (1,5-Hexadiene)(1-isopropyl-4-methylbenzene)ruthenium Complex and O2

(2014) Hyo Jun Jung et al.   CHEMISTRY OF MATERIALS

XPS Investigation of the Atomic Layer Deposition Half Reactions of Bis(N-tert-butyl-N′-ethylpropionamidinato) Cobalt(II)

(2014) Tyler D.-M. Elko-Hansen et al.   CHEMISTRY OF MATERIALS

Low-Temperature Atomic Layer Deposition of Copper Films Using Borane Dimethylamine as the Reducing Co-reagent

(2014) Lakmal C. Kalutarage et al.   CHEMISTRY OF MATERIALS

Structural evolution of platinum thin films grown by atomic layer deposition

(2014) Scott M. Geyer et al.   JOURNAL OF APPLIED PHYSICS

Effect of O3 on Growth of Pt by Atomic Layer Deposition

(2014) Han-Bo-Ram Lee et al.   Journal of Physical Chemistry C

Atomic Interdiffusion and Diffusive Stabilization of Cobalt by Copper During Atomic Layer Deposition from Bis(N-tert-butyl-N′-ethylpropionamidinato) Cobalt(II)

(2014) Tyler D.-M. Elko-Hansen et al.   Journal of Physical Chemistry Letters

1,4-Bis(trimethylsilyl)-1,4-diaza-2,5-cyclohexadienes as Strong Salt-Free Reductants for Generating Low-Valent Early Transition Metals with Electron-Donating Ligands

(2014) Teruhiko Saito et al.   JOURNAL OF THE AMERICAN CHEMICAL SOCIETY

In-situ spectroscopic ellipsometry study of copper selective-area atomic layer deposition on palladium

(2014) Xiaoqiang Jiang et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Atomic layer deposition of copper nitride film and its application to copper seed layer for electrodeposition

(2014) Jae-Min Park et al.   THIN SOLID FILMS

Trends in Copper Precursor Development for CVD and ALD Applications

(2014) Peter G. Gordon et al.   ECS Journal of Solid State Science and Technology

A cobalt layer deposition study: Dicobaltatetrahedranes as convenient MOCVD precursor systems

(2014) C. Georgi et al.   Journal of Materials Chemistry C

Atomic layer deposition of Cu with a carbene-stabilized Cu(i) silylamide

(2014) Dirk J. Hagen et al.   Journal of Materials Chemistry C

Suppressing Recombination in Polymer Photovoltaic Devices via Energy-Level Cascades

(2013) Zhi-Kuang Tan et al.   ADVANCED MATERIALS

New Liquid Precursors for the Metal-organic CVD of Gold Films

(2013) Roman G. Parkhomenko et al.   CHEMICAL VAPOR DEPOSITION

Thermal Chemistry of Cu(I)-Iminopyrrolidinate and Cu(I)-Guanidinate Atomic Layer Deposition (ALD) Precursors on Ni(110) Single-Crystal Surfaces

(2013) Taeseung Kim et al.   CHEMISTRY OF MATERIALS

Atomic Layer Deposition of Noble Metals and Their Oxides

(2013) Jani Hämäläinen et al.   CHEMISTRY OF MATERIALS

Deposition of Copper by Plasma-Enhanced Atomic Layer Deposition Using a Novel N-Heterocyclic Carbene Precursor

(2013) Jason P. Coyle et al.   CHEMISTRY OF MATERIALS

Precursors and chemistry for the atomic layer deposition of metallic first row transition metal films

(2013) Thomas J. Knisley et al.   COORDINATION CHEMISTRY REVIEWS

Synthesis, Structure, and Solution Reduction Reactions of Volatile and Thermally Stable Mid to Late First Row Transition Metal Complexes Containing Hydrazonate Ligands

(2013) Lakmal C. Kalutarage et al.   INORGANIC CHEMISTRY

Atomic Layer Deposited Co(W) Film as a Single-Layered Barrier/Liner for Next-Generation Cu-Interconnects

(2013) Hideharu Shimizu et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

TaCxThin Films Prepared by Atomic Layer Deposition as Diffusion Barriers for Cu Metallization

(2013) Tae Eun Hong et al.   JOURNAL OF THE AMERICAN CERAMIC SOCIETY

Growth of Highly Conformal TiCxFilms Using Atomic Layer Deposition Technique

(2013) Tae Eun Hong et al.   JOURNAL OF THE AMERICAN CERAMIC SOCIETY

Volatile and Thermally Stable Mid to Late Transition Metal Complexes Containing α-Imino Alkoxide Ligands, a New Strongly Reducing Coreagent, and Thermal Atomic Layer Deposition of Ni, Co, Fe, and Cr Metal Films

(2013) Lakmal C. Kalutarage et al.   JOURNAL OF THE AMERICAN CHEMICAL SOCIETY

Salt-Free Reducing Reagent of Bis(trimethylsilyl)cyclohexadiene Mediates Multielectron Reduction of Chloride Complexes of W(VI) and W(IV)

(2013) Hayato Tsurugi et al.   JOURNAL OF THE AMERICAN CHEMICAL SOCIETY

Mechanism of Co Liner as Enhancement Layer for Cu Interconnect Gap-Fill

(2013) M. He et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Low temperature hydrogen plasma-assisted atomic layer deposition of copper studied using in situ infrared reflection absorption spectroscopy

(2013) Rohan P. Chaukulkar et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Self-forming Al oxide barrier for nanoscale Cu interconnects created by hybrid atomic layer deposition of Cu–Al alloy

(2013) Jae-Hyung Park et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

The effect of particle proximity on the oxygen reduction rate of size-selected platinum clusters

(2013) Markus Nesselberger et al.   NATURE MATERIALS

O,N-coordinated Ni(II) beta-diketonate derivatives: Synthesis, thermal properties, MOCVD applications

(2013) G.I. Zharkova et al.   SURFACE & COATINGS TECHNOLOGY

Plasma enhanced atomic layer deposition of copper: A comparison of precursors

(2013) D.J. Hagen et al.   SURFACE & COATINGS TECHNOLOGY

Gold nanostructure formation in the photonic crystal matrix by means of MOCVD technique

(2013) R.G. Parkhomenko et al.   SURFACE & COATINGS TECHNOLOGY

Low temperature atomic layer deposition of noble metals using ozone and molecular hydrogen as reactants

(2013) Jani Hämäläinen et al.   THIN SOLID FILMS

Atomic layer deposition of ruthenium (Ru) thin films using ethylbenzen-cyclohexadiene Ru(0) as a seed layer for copper metallization

(2013) Seungmin Yeo et al.   THIN SOLID FILMS

One-dimensional CuO–SnO2 p–n heterojunctions for enhanced detection of H2S

(2013) Irina Giebelhaus et al.   Journal of Materials Chemistry A

Preventing thermolysis: precursor design for volatile copper compounds

(2012) Jason P. Coyle et al.   CHEMICAL COMMUNICATIONS

Substrate Selectivity of (tBu-Allyl)Co(CO)3 during Thermal Atomic Layer Deposition of Cobalt

(2012) Jinhee Kwon et al.   CHEMISTRY OF MATERIALS

Catalytic Combustion and Dehydrogenation Reactions during Atomic Layer Deposition of Platinum

(2012) Adriaan J. M. Mackus et al.   CHEMISTRY OF MATERIALS

The low temperature atomic layer deposition of ruthenium and the effect of oxygen exposure

(2012) Rungthiwa Methaapanon et al.   JOURNAL OF MATERIALS CHEMISTRY

Mechanism for the Atomic Layer Deposition of Copper Using Diethylzinc as the Reducing Agent: A Density Functional Theory Study Using Gas-Phase Molecules as a Model

(2012) Gangotri Dey et al.   JOURNAL OF PHYSICAL CHEMISTRY A

In Vacuo Photoemission Studies of Platinum Atomic Layer Deposition Using Synchrotron Radiation

(2012) Scott M. Geyer et al.   Journal of Physical Chemistry Letters

Copper deposition on TiO2 from copper(II)hexafluoroacetylacetonate

(2012) David G. Rayner et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Chemistry of Cu(acac)2 on Ni(110) and Cu(110) surfaces: Implications for atomic layer deposition processes

(2012) Qiang Ma et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Highly ordered and well aligned TiN nanotube arrays fabricated via template-assisted atomic layer deposition

(2012) Jaesung Yoon et al.   MATERIALS LETTERS

Deposition of Copper Films with Surface-Activating Agents

(2012) Jeffery S. Thompson et al.   ORGANOMETALLICS

Exceptional thermal stability and high volatility in mid to late first row transition metal complexes containing carbohydrazide ligands

(2012) Mahesh C. Karunarathne et al.   POLYHEDRON

New volatile heteroleptic complex of copper(II): Comparison of two polymorphs

(2012) V.V. Krisyuk et al.   POLYHEDRON

Superconducting niobium nitride thin films deposited by metal organic plasma-enhanced atomic layer deposition

(2012) Mario Ziegler et al.   SUPERCONDUCTOR SCIENCE & TECHNOLOGY

Plasma-enhanced atomic layer deposition of Cu–Mn films with formation of a MnSixOy barrier layer

(2012) Dae-Yong Moon et al.   THIN SOLID FILMS

Atomic layer deposition of platinum thin films on anodic aluminium oxide templates as surface-enhanced Raman scattering substrates

(2012) Wenjun Zhang et al.   VACUUM

Atomic Layer Deposition of Ru Thin Films Using a Ru(0) Metallorganic Precursor and O2

(2012) Tae Eun Hong et al.   ECS Journal of Solid State Science and Technology

Nucleation and Chemical Transformation of RuO2 Films Grown on (100) Si Substrates by Atomic Layer Deposition

(2011) Amelie Salaün et al.   CHEMICAL VAPOR DEPOSITION

Molybdenum Atomic Layer Deposition Using MoF6and Si2H6as the Reactants

(2011) D. Seghete et al.   CHEMISTRY OF MATERIALS

Atomic Layer Deposition of Osmium

(2011) Jani Hämäläinen et al.   CHEMISTRY OF MATERIALS

Plasma-Enhanced Atomic Layer Deposition of Silver Thin Films

(2011) Maarit Kariniemi et al.   CHEMISTRY OF MATERIALS

Low Temperature Growth of High Purity, Low Resistivity Copper Films by Atomic Layer Deposition

(2011) Thomas J. Knisley et al.   CHEMISTRY OF MATERIALS

Plasma-Enhanced Atomic Layer Deposition of TaCx Films Using Tris(neopentyl) Tantalum Dichloride and H2 Plasma

(2011) Tae-Ho Kim et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Characterization of Cu Reflows on Ru

(2011) C.-C. Yang et al.   IEEE ELECTRON DEVICE LETTERS

Low-Temperature Reflow Anneals of Cu on Ru

(2011) C.-C. Yang et al.   IEEE ELECTRON DEVICE LETTERS

MOSFETs Made From GaN Nanowires With Fully Conformal Cylindrical Gates

(2011) Paul T. Blanchard et al.   IEEE TRANSACTIONS ON NANOTECHNOLOGY

Direct-on-barrier copper electroplating on ruthenium from the ionic liquid 1-ethyl-3-methylimidazolium dicyanamide

(2011) Lucia D’Urzo et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Understanding 'Clean-Up' of III–V Native Oxides During Atomic Layer Deposition Using Bulk First Principles Models

(2011) Sylwia Klejna et al.   JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY

Thermal Atomic Layer Deposition (ALD) of Ru Films for Cu Direct Plating

(2011) Sang-Hyeok Choi et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Filling Narrow Trenches by Iodine-Catalyzed CVD of Copper and Manganese on Manganese Nitride Barrier/Adhesion Layers

(2011) Yeung Au et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Atomic layer deposition of Ru from CpRu(CO)2Et using O2 gas and O2 plasma

(2011) N. Leick et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Hot-wire-assisted atomic layer deposition of a high quality cobalt film using cobaltocene: Elementary reaction analysis on NHx radical formation

(2011) Hideharu Shimizu et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Thermal chemistry of copper(I)-N,N ′-di-sec-butylacetamidinate on Cu(110) single-crystal surfaces

(2011) Qiang Ma et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Influence of the deposition temperature on the properties of copper thin films prepared by alternating injection of Cu(ethylketoiminate)2 and H2 on a ruthenium substrate

(2011) Kwang-Min Park et al.   MICROELECTRONIC ENGINEERING

Volatility and High Thermal Stability in Mid- to Late-First-Row Transition-Metal Diazadienyl Complexes

(2011) Thomas J. Knisley et al.   ORGANOMETALLICS

Surface poisoning in the nucleation and growth of palladium atomic layer deposition with Pd(hfac)2 and formalin

(2011) D.N. Goldstein et al.   THIN SOLID FILMS

Effect of catalyst for nickel films for NiSi formation with improved interface roughness

(2011) Hee-Sung Kang et al.   THIN SOLID FILMS

Enhancing the Wettability of High Aspect-Ratio Through-Silicon Vias Lined With LPCVD Silicon Nitride or PE-ALD Titanium Nitride for Void-Free Bottom-Up Copper Electroplating

(2011) Mohamed Saadaoui et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

The Synthesis of Highly Loaded Cu/Al2O3and Cu/ZnO/Al2O3Catalysts by the Two-Step CVD of CuIIdiethylamino-2-propoxide in a Fluidized-Bed Reactor

(2010) Michael Becker et al.   CHEMICAL VAPOR DEPOSITION

Solution Reactions of a Bis(pyrrolylaldiminate)copper(II) Complex with Peralkyl Zinc, Aluminum, and Boron Reagents: Investigation of the Pathways Responsible for Copper Metal Deposition

(2010) Balamurugan Vidjayacoumar et al.   CHEMISTRY OF MATERIALS

Atomic Layer Deposition of Ru/RuO2Thin Films Studied by In situ Infrared Spectroscopy

(2010) S. K. Park et al.   CHEMISTRY OF MATERIALS

Investigation on the Growth Initiation of Ru Thin Films by Atomic Layer Deposition

(2010) Seong Keun Kim et al.   CHEMISTRY OF MATERIALS

Investigation of AlMe3, BEt3, and ZnEt2as Co-Reagents for Low-Temperature Copper Metal ALD/Pulsed-CVD

(2010) Balamurugan Vidjayacoumar et al.   CHEMISTRY OF MATERIALS

Growth of Cu Metal Films at Room Temperature Using Catalyzed Reactions

(2010) Sang-Woo Kang et al.   CHEMISTRY OF MATERIALS

Characterization of Selectively Deposited Cobalt Capping Layers: Selectivity and Electromigration Resistance

(2010) C.-C Yang et al.   IEEE ELECTRON DEVICE LETTERS

Gas-Phase Thermolysis of a Guanidinate Precursor of Copper Studied by Matrix Isolation, Time-of-Flight Mass Spectrometry, and Computational Chemistry

(2010) Jason P. Coyle et al.   INORGANIC CHEMISTRY

Electron beam irradiation of dimethyl-(acetylacetonate) gold(III) adsorbed onto solid substrates

(2010) Joshua D. Wnuk et al.   JOURNAL OF APPLIED PHYSICS

Conformality of Plasma-Assisted ALD: Physical Processes and Modeling

(2010) H. C. M. Knoops et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Atomic Layer Deposition of Ni Thin Films and Application to Area-Selective Deposition

(2010) Woo-Hee Kim et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

?The Degradation of Deposition Blocking Layer during Area Selective Plasma Enhanced Atomic Layer Deposition of Cobalt

(2010) Hyungjun Kim et al.   JOURNAL OF THE KOREAN PHYSICAL SOCIETY

Surface and Interface Processes during Atomic Layer Deposition of Copper on Silicon Oxide

(2010) Min Dai et al.   LANGMUIR

Mechanism, Products, and Growth Rate of Atomic Layer Deposition of Noble Metals

(2010) Simon D. Elliott   LANGMUIR

ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems

(2010) Thomas Waechtler et al.   MICROELECTRONIC ENGINEERING

Liquid injection atomic layer deposition of silver nanoparticles

(2010) P R Chalker et al.   NANOTECHNOLOGY

Nanowire transistors without junctions

(2010) Jean-Pierre Colinge et al.   Nature Nanotechnology

First-Principles Simulations of Conditions of Enhanced Adhesion Between Copper and TaN(111) Surfaces Using a Variety of Metallic Glue Materials

(2009) Bo Han et al.   ANGEWANDTE CHEMIE-INTERNATIONAL EDITION

Enhancing the nucleation of palladium atomic layer deposition on Al2O3 using trimethylaluminum to prevent surface poisoning by reaction products

(2009) D. N. Goldstein et al.   APPLIED PHYSICS LETTERS

Atomic Layer Deposition: An Overview

(2009) Steven M. George   CHEMICAL REVIEWS

Atomic Layer Deposition of Ruthenium Thin Films from an Amidinate Precursor

(2009) Hongtao Wang et al.   CHEMICAL VAPOR DEPOSITION

Atomic Layer Deposition of Iridium Thin Films by Consecutive Oxidation and Reduction Steps

(2009) Jani Hämäläinen et al.   CHEMISTRY OF MATERIALS

Uptake of Copper Acetamidinate ALD Precursors on Nickel Surfaces

(2009) Qiang Ma et al.   CHEMISTRY OF MATERIALS

Low Temperature Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and O[sub 2]

(2009) Tae-Kwang Eom et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Stability of iodine on ruthenium during copper electrodeposition and its effects on the nucleation behavior of electrodeposited copper

(2009) Cameron Bjelkevig et al.   ELECTROCHIMICA ACTA

Nucleation period, surface roughness, and oscillations in mass gain per cycle during W atomic layer deposition on Al2O3

(2009) R. W. Wind et al.   JOURNAL OF APPLIED PHYSICS

Copper−Metal Deposition on Self Assembled Monolayer for Making Top Contacts in Molecular Electronic Devices

(2009) Oliver Seitz et al.   JOURNAL OF THE AMERICAN CHEMICAL SOCIETY

New Tantalum Ligand-Free Catalyst System for Highly Selective Trimerization of Ethylene Affording 1-Hexene: New Evidence of a Metallacycle Mechanism

(2009) Rocío Arteaga-Müller et al.   JOURNAL OF THE AMERICAN CHEMICAL SOCIETY

Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications

(2009) L. Wu et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Copper Oxide Films Grown by Atomic Layer Deposition from Bis(tri-n-butylphosphane)copper(I)acetylacetonate on Ta, TaN, Ru, and SiO[sub 2]

(2009) Thomas Waechtler et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

High Quality Area-Selective Atomic Layer Deposition Co Using Ammonia Gas as a Reactant

(2009) Han-Bo-Ram Lee et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Interface Properties of Nickel-silicide Films Deposited by UsingPlasma-assisted Atomic Layer Deposition

(2009) Kwang-Man Lee et al.   JOURNAL OF THE KOREAN PHYSICAL SOCIETY

Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications

(2009) Sumit Kumar et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Characterization of ALD copper thin films on palladium seed layers

(2009) Irene J. Hsu et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Controlled Growth of Platinum Nanoparticles on Strontium Titanate Nanocubes by Atomic Layer Deposition

(2009) Steven T. Christensen et al.   Small

Growth studies and characterization of silicon nitride thin films deposited by alternating exposures to Si2Cl6 and NH3

(2009) Kwangchol Park et al.   THIN SOLID FILMS

Atomic Layer Deposition of Platinum Oxide and Metallic Platinum Thin Films from Pt(acac)2and Ozone

(2008) Jani Hämäläinen et al.   CHEMISTRY OF MATERIALS

The Role of the Methyl and Hydroxyl Groups of Low-k Dielectric Films on the Nucleation of Ruthenium by ALD

(2008) Jaeyeong Heo et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper

(2008) L. Wu et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Nucleation kinetics of Ru on silicon oxide and silicon nitride surfaces deposited by atomic layer deposition

(2008) Sung-Soo Yim et al.   JOURNAL OF APPLIED PHYSICS

Phase control of iridium and iridium oxide thin films in atomic layer deposition

(2008) Sung-Wook Kim et al.   JOURNAL OF APPLIED PHYSICS

A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu

(2008) Soo-Hyun Kim et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD

(2008) Sung-Wook Kim et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

New precursors for CVD copper metallization

(2008) John A.T. Norman et al.   MICROELECTRONIC ENGINEERING

Atomic layer deposition of titanium nitride from TDMAT precursor

(2008) J. Musschoot et al.   MICROELECTRONIC ENGINEERING

Combined experimental and theoretical study of thin hafnia films

(2008) X. Luo et al.   PHYSICAL REVIEW B

Adsorption, orientation and thermal decomposition of copper(II) hexafluoroacetylacetonate on rutile TiO2(110)

(2008) J.S. Mulley et al.   SURFACE SCIENCE

Vapor phase deposition of copper films with a Cu(I) β-diketiminate precursor

(2008) Jeffery S. Thompson et al.   THIN SOLID FILMS

Synthesis and Thermal Chemistry of Copper (I) Guanidinates

(2007) Jason P. Coyle et al.   INORGANIC CHEMISTRY