Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications

Published 2009 View Full Article

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Title
Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
Authors
Keywords
-
Journal
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A
Volume 27, Issue 3, Pages 572-576
Publisher
American Vacuum Society
Online
2009-05-03
DOI
10.1116/1.3122664

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