Mechanism of Co Liner as Enhancement Layer for Cu Interconnect Gap-Fill

In Situ Co/SiC(N,H) Capping Layers for Cu/Low- k Interconnects

(2012) C.-C. Yang et al.   IEEE ELECTRON DEVICE LETTERS

Electromigration in Cu(Al) and Cu(Mn) damascene lines

(2012) C.-K. Hu et al.   JOURNAL OF APPLIED PHYSICS

Resistivity of sub-50nm copper lines epitaxially grown on Si(100) substrate

(2012) Pei-I Wang et al.   THIN SOLID FILMS

Characterization of “Ultrathin-Cu”/Ru(Ta)/TaN Liner Stack for Copper Interconnects

(2010) C.-C Yang et al.   IEEE ELECTRON DEVICE LETTERS

Void-Free Filling of HAR TSVs Using a Wet Alkaline Cu Seed on CVD Co as a Replacement for PVD Cu Seed

(2010) S. Armini et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Grain morphology of Cu damascene lines

(2009) Stefan Brandstetter et al.   MICROELECTRONIC ENGINEERING