Atomic layer deposition of ruthenium (Ru) thin films using ethylbenzen-cyclohexadiene Ru(0) as a seed layer for copper metallization

Published 2013 View Full Article

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Title
Atomic layer deposition of ruthenium (Ru) thin films using ethylbenzen-cyclohexadiene Ru(0) as a seed layer for copper metallization
Authors
Keywords
-
Journal
THIN SOLID FILMS
Volume 546, Issue -, Pages 2-8
Publisher
Elsevier BV
Online
2013-04-04
DOI
10.1016/j.tsf.2013.03.074

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