Low-Temperature Atomic Layer Deposition of Copper Films Using Borane Dimethylamine as the Reducing Co-reagent

Published 2014 View Full Article

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Title
Low-Temperature Atomic Layer Deposition of Copper Films Using Borane Dimethylamine as the Reducing Co-reagent
Authors
Keywords
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Journal
CHEMISTRY OF MATERIALS
Volume 26, Issue 12, Pages 3731-3738
Publisher
American Chemical Society (ACS)
Online
2014-06-05
DOI
10.1021/cm501109r

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