Thermal Atomic Layer Deposition (ALD) of Ru Films for Cu Direct Plating

Title
Thermal Atomic Layer Deposition (ALD) of Ru Films for Cu Direct Plating
Authors
Keywords
-
Journal
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
Volume 158, Issue 6, Pages D351
Publisher
The Electrochemical Society
Online
2011-04-13
DOI
10.1149/1.3575163

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