First-Principles Simulations of Conditions of Enhanced Adhesion Between Copper and TaN(111) Surfaces Using a Variety of Metallic Glue Materials

Published 2009 View Full Article

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Title
First-Principles Simulations of Conditions of Enhanced Adhesion Between Copper and TaN(111) Surfaces Using a Variety of Metallic Glue Materials
Authors
Keywords
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Journal
ANGEWANDTE CHEMIE-INTERNATIONAL EDITION
Volume 49, Issue 1, Pages 148-152
Publisher
Wiley
Online
2009-11-28
DOI
10.1002/anie.200905360
References
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