TaCxThin Films Prepared by Atomic Layer Deposition as Diffusion Barriers for Cu Metallization

Influence of Sputtering Target Power on Microstructure and Mechanical Properties of W-N and Ta-N Coatings

(2012) J. F. Yang et al.   Nanoscience and Nanotechnology Letters

Plasma-Enhanced Atomic Layer Deposition of TaCx Films Using Tris(neopentyl) Tantalum Dichloride and H2 Plasma

(2011) Tae-Ho Kim et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Plasma-Enhanced Atomic Layer Deposition of TaC[sub x]N[sub y] Films with tert-Butylimido Tris-diethylamido Tantalum and Methane/Hydrogen Gas

(2010) Gi-hee Cho et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Ta3N5 photoanodes for water splitting prepared by sputtering

(2010) Daisuke Yokoyama et al.   THIN SOLID FILMS

Atomic Layer Deposition: An Overview

(2009) Steven M. George   CHEMICAL REVIEWS

Atom beam sputtered Mo2C films as a diffusion barrier for copper metallization

(2008) C.C. Tripathi et al.   APPLIED SURFACE SCIENCE

Deposition of TiN and TaN by Remote Plasma ALD for Cu and Li Diffusion Barrier Applications

(2008) H. C. M. Knoops et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Phase Formation in the Tantalum Carbonitride Film Deposited with Atomic Layer Deposition Using Ammonia

(2008) Moon-Kyun Song et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Applications of atomic layer deposition to nanofabrication and emerging nanodevices

(2008) Hyungjun Kim et al.   THIN SOLID FILMS