Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications

Title
Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
Authors
Keywords
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Journal
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
Volume 156, Issue 9, Pages H734
Publisher
The Electrochemical Society
Online
2009-07-25
DOI
10.1149/1.3166184

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