Deposition of Copper by Plasma-Enhanced Atomic Layer Deposition Using a Novel N-Heterocyclic Carbene Precursor

Title
Deposition of Copper by Plasma-Enhanced Atomic Layer Deposition Using a Novel N-Heterocyclic Carbene Precursor
Authors
Keywords
-
Journal
CHEMISTRY OF MATERIALS
Volume 25, Issue 7, Pages 1132-1138
Publisher
American Chemical Society (ACS)
Online
2013-03-15
DOI
10.1021/cm400215q

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