Quantum chemical and solution phase evaluation of metallocenes as reducing agents for the prospective atomic layer deposition of copper
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Title
Quantum chemical and solution phase evaluation of metallocenes as reducing agents for the prospective atomic layer deposition of copper
Authors
Keywords
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Journal
DALTON TRANSACTIONS
Volume 44, Issue 22, Pages 10188-10199
Publisher
Royal Society of Chemistry (RSC)
Online
2015-04-18
DOI
10.1039/c5dt00922g
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- (2014) Peter G. Gordon et al. ECS Journal of Solid State Science and Technology
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- Deposition of Copper by Plasma-Enhanced Atomic Layer Deposition Using a Novel N-Heterocyclic Carbene Precursor
- (2013) Jason P. Coyle et al. CHEMISTRY OF MATERIALS
- Precursors and chemistry for the atomic layer deposition of metallic first row transition metal films
- (2013) Thomas J. Knisley et al. COORDINATION CHEMISTRY REVIEWS
- Metal ALD and pulsed CVD: Fundamental reactions and links with solution chemistry
- (2013) David J.H. Emslie et al. COORDINATION CHEMISTRY REVIEWS
- Reduction mechanisms of the CuO(111) surface through surface oxygen vacancy formation and hydrogen adsorption
- (2013) Yasheng Maimaiti et al. PHYSICAL CHEMISTRY CHEMICAL PHYSICS
- Plasma enhanced atomic layer deposition of copper: A comparison of precursors
- (2013) D.J. Hagen et al. SURFACE & COATINGS TECHNOLOGY
- Mechanism for the Atomic Layer Deposition of Copper Using Diethylzinc as the Reducing Agent: A Density Functional Theory Study Using Gas-Phase Molecules as a Model
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- Atomic Layer Deposition of Osmium
- (2011) Jani Hämäläinen et al. CHEMISTRY OF MATERIALS
- Surface Chemistry of Copper(I) Acetamidinates in Connection with Atomic Layer Deposition (ALD) Processes
- (2011) Qiang Ma et al. CHEMISTRY OF MATERIALS
- Low Temperature Growth of High Purity, Low Resistivity Copper Films by Atomic Layer Deposition
- (2011) Thomas J. Knisley et al. CHEMISTRY OF MATERIALS
- Atomic Layer Deposition of Fe2O3 Using Ferrocene and Ozone
- (2011) Alex B. F. Martinson et al. Journal of Physical Chemistry C
- Hot-wire-assisted atomic layer deposition of a high quality cobalt film using cobaltocene: Elementary reaction analysis on NHx radical formation
- (2011) Hideharu Shimizu et al. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A
- Solution Reactions of a Bis(pyrrolylaldiminate)copper(II) Complex with Peralkyl Zinc, Aluminum, and Boron Reagents: Investigation of the Pathways Responsible for Copper Metal Deposition
- (2010) Balamurugan Vidjayacoumar et al. CHEMISTRY OF MATERIALS
- Investigation of AlMe3, BEt3, and ZnEt2as Co-Reagents for Low-Temperature Copper Metal ALD/Pulsed-CVD
- (2010) Balamurugan Vidjayacoumar et al. CHEMISTRY OF MATERIALS
- Growth of Cu Metal Films at Room Temperature Using Catalyzed Reactions
- (2010) Sang-Woo Kang et al. CHEMISTRY OF MATERIALS
- Low-Temperature Atomic Layer Deposition of Copper Metal Thin Films: Self-Limiting Surface Reaction of Copper Dimethylamino-2-propoxide with Diethylzinc
- (2009) Byoung H. Lee et al. ANGEWANDTE CHEMIE-INTERNATIONAL EDITION
- Copper Oxide Films Grown by Atomic Layer Deposition from Bis(tri-n-butylphosphane)copper(I)acetylacetonate on Ta, TaN, Ru, and SiO[sub 2]
- (2009) Thomas Waechtler et al. JOURNAL OF THE ELECTROCHEMICAL SOCIETY
- Characterization of ALD copper thin films on palladium seed layers
- (2009) Irene J. Hsu et al. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A
- Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper
- (2008) L. Wu et al. ELECTROCHEMICAL AND SOLID STATE LETTERS
- Deposition of ZrO2 and HfO2 thin films by liquid injection MOCVD and ALD using ansa-metallocene zirconium and hafnium precursors
- (2008) Kate Black et al. JOURNAL OF MATERIALS CHEMISTRY
- New precursors for CVD copper metallization
- (2008) John A.T. Norman et al. MICROELECTRONIC ENGINEERING
- Orientation of individualC60molecules adsorbed on Cu(111): Low-temperature scanning tunneling microscopy and density functional calculations
- (2008) J. Andreas Larsson et al. PHYSICAL REVIEW B
- Vapor phase deposition of copper films with a Cu(I) β-diketiminate precursor
- (2008) Jeffery S. Thompson et al. THIN SOLID FILMS
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