Dielectric Barrier, Etch Stop, and Metal Capping Materials for State of the Art and beyond Metal Interconnects

Atomic layer deposited lithium aluminum oxide: (In)dependency of film properties from pulsing sequence

(2015) Ville Miikkulainen et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Valence and conduction band offsets at amorphous hexagonal boron nitride interfaces with silicon network dielectrics

(2014) Sean W. King et al.   APPLIED PHYSICS LETTERS

1-nm-thick graphene tri-layer as the ultimate copper diffusion barrier

(2014) Ba-Son Nguyen et al.   APPLIED PHYSICS LETTERS

Boron nitride nanosheets as oxygen-atom corrosion protective coatings

(2014) Min Yi et al.   APPLIED PHYSICS LETTERS

Resistivity scaling and electron relaxation times in metallic nanowires

(2014) Kristof Moors et al.   JOURNAL OF APPLIED PHYSICS

Effect of low-frequency radio frequency on plasma-enhanced chemical vapor deposited ultra low-κ dielectric films for very large-scale integrated interconnects

(2014) E. Todd Ryan et al.   JOURNAL OF APPLIED PHYSICS

Defect structure and electronic properties of SiOC:H films used for back end of line dielectrics

(2014) T. A. Pomorski et al.   JOURNAL OF APPLIED PHYSICS

Relationship between the structure and electrical characteristics of diamond-like carbon films

(2014) Radek Ješko   JOURNAL OF APPLIED PHYSICS

Influence of hydrogen content and network connectivity on the coefficient of thermal expansion and thermal stability for a-SiC:H thin films

(2014) Sean W. King et al.   JOURNAL OF NON-CRYSTALLINE SOLIDS

Statistical mechanics of glass

(2014) John C. Mauro et al.   JOURNAL OF NON-CRYSTALLINE SOLIDS

Desorption and sublimation kinetics for fluorinated aluminum nitride surfaces

(2014) Sean W. King et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Time-dependent dielectric breakdown measurements of porous organosilicate glass using mercury and solid metal probes

(2014) Dongfei Pei et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Effect of water uptake on the fracture behavior of low-k organosilicate glass

(2014) Xiangyu Guo et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Effect of NH3/N2 ratio in plasma treatment on porous low dielectric constant SiCOH materials

(2014) Jun-Fu Huang et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

History of diamond-like carbon films — From first experiments to worldwide applications

(2014) Klaus Bewilogua et al.   SURFACE & COATINGS TECHNOLOGY

Buckling-delamination and cracking of thin titanium films under compression: Experimental and numerical studies

(2014) Xiuli Xue et al.   SURFACE & COATINGS TECHNOLOGY

Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art

(2014) Alfred Grill et al.   Applied Physics Reviews

Tunable Plasticity in Amorphous Silicon Carbide Films

(2013) Yusuke Matsuda et al.   ACS Applied Materials & Interfaces

Graphene as a Long-Term Metal Oxidation Barrier: Worse Than Nothing

(2013) Maria Schriver et al.   ACS Nano

Approaching the limits of dielectric breakdown for SiO2 films deposited by plasma-enhanced atomic layer deposition

(2013) Takane Usui et al.   ACTA MATERIALIA

Progress and prospective of solid-state lithium batteries

(2013) Kazunori Takada   ACTA MATERIALIA

Evidence of ultra-low-k dielectric material degradation and nanostructure alteration of the Cu/ultra-low-k interconnects in time-dependent dielectric breakdown failure

(2013) Jeffrey C. K. Lam et al.   APPLIED PHYSICS LETTERS

Study of viscoplastic deformation in porous organosilicate thin films for ultra low-k applications

(2013) Emil H. Zin et al.   APPLIED PHYSICS LETTERS

Role of graphene defects in corrosion of graphene-coated Cu(111) surface

(2013) I. Wlasny et al.   APPLIED PHYSICS LETTERS

Moisture-assisted cracking and atomistic crack path meandering in oxidized hydrogenated amorphous silicon carbide films

(2013) Yusuke Matsuda et al.   JOURNAL OF APPLIED PHYSICS

On the dynamics of Cu ions injection into low-k nanoporous materials under oscillating applied fields

(2013) Juan Borja et al.   JOURNAL OF APPLIED PHYSICS

Generalized hydrogen release-reaction model for the breakdown of modern gate dielectrics

(2013) Ernest Y. Wu et al.   JOURNAL OF APPLIED PHYSICS

Defects and electronic transport in hydrogenated amorphous SiC films of interest for low dielectric constant back end of the line dielectric systems

(2013) T. A. Pomorski et al.   JOURNAL OF APPLIED PHYSICS

Plasma processing of low-k dielectrics

(2013) Mikhail R. Baklanov et al.   JOURNAL OF APPLIED PHYSICS

Thermal Conductivity Measurement of Low-k Dielectric Films: Effect of Porosity and Density

(2013) M. T. Alam et al.   JOURNAL OF ELECTRONIC MATERIALS

Characteristics of Plasma-Treated Amorphous Ta-Si-C Film as a Diffusion Barrier for Copper Metallization

(2013) Jau-Shiung Fang et al.   JOURNAL OF ELECTRONIC MATERIALS

The effect of the pore topology on the elastic modulus of organosilicate glasses

(2013) Kong-Boon Yeap et al.   JOURNAL OF MATERIALS RESEARCH

Characterization of wafer geometry and overlay error on silicon wafers with nonuniform stress

(2013) Timothy A. Brunner et al.   Journal of Micro-Nanolithography MEMS and MOEMS

Noncontact optical metrologies for Young’s modulus measurements of nanoporous low-k dielectric thin films

(2013) Brian C. Daly et al.   Journal of Nanophotonics

Influence of network bond percolation on the thermal, mechanical, electrical and optical properties of high and low-k a-SiC:H thin films

(2013) Sean W. King et al.   JOURNAL OF NON-CRYSTALLINE SOLIDS

Characterization of very low thermal conductivity thin films

(2013) M. T. Alam et al.   JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY

Highly reliable enhanced nitride interface process of barrier low-k using ultra-thin SiN with moisture blocking capability

(2013) Tatsuya Usami et al.   MICROELECTRONIC ENGINEERING

Low-k a-SiCO:H films as diffusion barriers for advanced interconnects

(2013) Els Van Besien et al.   MICROELECTRONIC ENGINEERING

Effect of moisture on electrical properties and reliability of low dielectric constant materials

(2013) Yi-Lung Cheng et al.   MICROELECTRONIC ENGINEERING

Material design of plasma-enhanced chemical vapour deposition SiCH films for low-kcap layers in the further scaling of ultra-large-scale integrated devices-Cu interconnects

(2013) Hideharu Shimizu et al.   SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS

Toughening Thin-Film Structures with Ceramic-Like Amorphous Silicon Carbide Films

(2013) Yusuke Matsuda et al.   Small

Impact of plasma treatment on structure and electrical properties of porous low dielectric constant SiCOH material

(2013) Yi-Lung Cheng et al.   THIN SOLID FILMS

Elastic properties of tensile nitrogen-plasma-treated multilayer silicon nitride films

(2013) M. Braccini et al.   THIN SOLID FILMS

Study of Conduction Modes of Time to Dielectric Breakdown Reliability in Cu Damascene Structures

(2013) H. L. Chang et al.   ECS Journal of Solid State Science and Technology

Research Updates: The three M's (materials, metrology, and modeling) together pave the path to future nanoelectronic technologies

(2013) Sean W. King et al.   APL Materials

Nanoscale Noncontact Subsurface Investigations of Mechanical and Optical Properties of Nanoporous Low-k Material Thin Film

(2012) Alexey M. Lomonosov et al.   ACS Nano

Environmentally assisted debonding of copper/barrier interfaces

(2012) Ryan P. Birringer et al.   ACTA MATERIALIA

Invasion percolation model for abnormal time-dependent dielectric breakdown characteristic of low-k dielectrics due to massive metallic diffusion

(2012) Fen Chen et al.   APPLIED PHYSICS LETTERS

Corrosion of Si-O based porous low-k dielectrics

(2012) A. B. Hall et al.   APPLIED PHYSICS LETTERS

Size effect on the electron wind force for electromigration at the top metal-dielectric interface in nanoscale interconnects

(2012) Zhuo-Jie Wu et al.   APPLIED PHYSICS LETTERS

Intrinsic effect of porosity on mechanical and fracture properties of nanoporous ultralow-k dielectrics

(2012) K. Vanstreels et al.   APPLIED PHYSICS LETTERS

Time-dependent dielectric breakdown of plasma-exposed porous organosilicate glass

(2012) M. T. Nichols et al.   APPLIED PHYSICS LETTERS

Cu Contamination of the nMOSFET in a 3-D Integrated Circuit under Thermal and Electrical Stress

(2012) Han-Wool Yeon et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Simulations of Damage, Crack Initiation, and Propagation in Interlayer Dielectric Structures: Understanding Assembly-Induced Fracture in Dies

(2012) Abhishek Tambat et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Electromigration in Cu(Al) and Cu(Mn) damascene lines

(2012) C.-K. Hu et al.   JOURNAL OF APPLIED PHYSICS

Conduction and material transport phenomena of degradation in electrically stressed ultra low-k dielectric before breakdown

(2012) T. Breuer et al.   JOURNAL OF APPLIED PHYSICS

The effects of vacuum ultraviolet radiation on low-kdielectric films

(2012) H. Sinha et al.   JOURNAL OF APPLIED PHYSICS

A review of monolithic and multilayer coatings within the boron–carbon–nitrogen system by ion-beam-assisted deposition

(2012) Ignacio Jiménez et al.   JOURNAL OF MATERIALS RESEARCH

Mechanical properties of high porosity low-kdielectric nano-films determined by Brillouin light scattering

(2012) S Bailey et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Low-k SiCxNyFilms Prepared by Plasma-Enhanced Chemical Vapor Deposition Using 1,3,5-trimethyl-1,3,5-trivinylcyclotrisilazane Precursor

(2012) Hung-En Tu et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Stability and annealing of alucones and alucone alloys

(2012) Lilit Ghazaryan et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Time dependent dielectric breakdown physics – Models revisited

(2012) J.W. McPherson   MICROELECTRONICS RELIABILITY

Nanoscale mapping of contact stiffness and damping by contact resonance atomic force microscopy

(2012) Gheorghe Stan et al.   NANOTECHNOLOGY

Tailored amorphous silicon carbide barrier dielectrics by nitrogen and oxygen doping

(2012) Yusuke Matsuda et al.   THIN SOLID FILMS

Dissolution of CF-Polymer Films at Ultra Low-k Surfaces Using Diluted HF

(2012) R. Leitsmann et al.   ECS Journal of Solid State Science and Technology

Film Property Requirements for Hermetic Low-k a-SiOxCyNz:H Dielectric Barriers

(2012) S. W. King et al.   ECS Journal of Solid State Science and Technology

Oxidation Resistance of Graphene-Coated Cu and Cu/Ni Alloy

(2011) Shanshan Chen et al.   ACS Nano

Fracture properties of hydrogenated amorphous silicon carbide thin films

(2011) Y. Matsuda et al.   ACTA MATERIALIA

Role of copper in time dependent dielectric breakdown of porous organo-silicate glass low-k materials

(2011) Larry Zhao et al.   APPLIED PHYSICS LETTERS

Inversion type InP metal oxide semiconductor field effect transistor using novel atomic layer deposited BeO gate dielectric

(2011) J. H. Yum et al.   APPLIED PHYSICS LETTERS

X-ray photoelectron spectroscopy investigation of the Schottky barrier at low-k a-SiO(C):H/Cu interfaces

(2011) S. W. King et al.   APPLIED PHYSICS LETTERS

Atomic layer deposition of organic–inorganic hybrid materials based on saturated linear carboxylic acids

(2011) Karina Barnholt Klepper et al.   DALTON TRANSACTIONS

X-ray Photoelectron Spectroscopy Investigation of the Schottky Barrier at a-BN:H∕Cu Interfaces

(2011) S. W. King et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Fourier Transform Infrared Spectroscopy of Moisturized Low-$\kappa$ Dielectric Materials

(2011) Christoph Kubasch et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Epitaxial ALD BeO: Efficient Oxygen Diffusion Barrier for EOT Scaling and Reliability Improvement

(2011) Jung Hwan Yum et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Isobutyl Silane Precursors for SiCH Low-kCap Layer beyond the 22 nm Node: Analysis of Film Structure for Compatibility of Lowerk-value and High Barrier Properties

(2011) Hideharu Shimizu et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Novel Precursors for SiCH Low-$k$ Caps beyond the 22 nm Node: Reactions of Silacyclopentane Precursors in the Plasma-Enhanced Chemical Vapor Deposition Process and Structural Analyses of SiCH Films

(2011) Hideharu Shimizu et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Effects of barrier composition and electroplating chemistry on adhesion and voiding in copper/dielectric diffusion barrier films

(2011) Ryan P. Birringer et al.   JOURNAL OF APPLIED PHYSICS

Elastic properties of porous low-k dielectric nano-films

(2011) W. Zhou et al.   JOURNAL OF APPLIED PHYSICS

Atomic layer deposited beryllium oxide: Effective passivation layer for III-V metal/oxide/semiconductor devices

(2011) J. H. Yum et al.   JOURNAL OF APPLIED PHYSICS

A study of highly crystalline novel beryllium oxide film using atomic layer deposition

(2011) J.H. Yum et al.   JOURNAL OF CRYSTAL GROWTH

Fourier transform infrared spectroscopy investigation of chemical bonding in low-k a-SiC:H thin films

(2011) S.W. King et al.   JOURNAL OF NON-CRYSTALLINE SOLIDS

Mass and bond density measurements for PECVD a-SiCx:H thin films using Fourier transform-infrared spectroscopy

(2011) S.W. King et al.   JOURNAL OF NON-CRYSTALLINE SOLIDS

Modelling the erosion of beryllium carbide surfaces

(2011) M. Mehine et al.   JOURNAL OF NUCLEAR MATERIALS

The local physical structure of amorphous hydrogenated boron carbide: insights from magic angle spinning solid-state NMR spectroscopy

(2011) Michelle M Paquette et al.   JOURNAL OF PHYSICS-CONDENSED MATTER

Effects of Post-CMP Cleaning on Time Dependent Dielectric Breakdown and Electro-Migration in Porous Low-k∕Cu Interconnects

(2011) Chia-Lin Hsu et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Post Plasma Etch Residue Removal in Dilute HF Solutions

(2011) D. P. R. Thanu et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Mechanisms for sealing of porous low-k SiOCH by combined He and NH3 plasma treatment

(2011) Juline Shoeb et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Comparison of the self-cleaning effects and electrical characteristics of BeO and Al2O3 deposited as an interface passivation layer on GaAs MOS devices

(2011) J. H. Yum et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Plasma enhanced atomic layer deposition of SiNx:H and SiO2

(2011) Sean W. King   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Dielectric performance of hybrid alumina-silicone nanolaminates synthesized by plasma enhanced chemical vapor deposition

(2011) Rakhi P. Patel et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Moore’s crystal ball: Device physics and technology past the 15nm generation

(2011) Kelin J. Kuhn   MICROELECTRONIC ENGINEERING

MIM in 3D: Dream or reality? (invited)

(2011) J.H. Klootwijk et al.   MICROELECTRONIC ENGINEERING

Alkoxysilane layers compatible with Cu deposition: Towards new diffusion barriers?

(2011) D. Rébiscoul et al.   MICROELECTRONIC ENGINEERING

Silicon precursor development for advanced dielectric barriers for VLSI technology

(2011) Anupama Mallikarjunan et al.   MICROELECTRONIC ENGINEERING

Bias polarity and frequency effects of Cu-induced dielectric breakdown in damascene Cu interconnects

(2011) Sung-Yup Jung et al.   MICROELECTRONIC ENGINEERING

Synergistic combinations of dielectrics and metallization process technology to achieve 22nm interconnect performance targets

(2011) G.A. Antonelli et al.   MICROELECTRONIC ENGINEERING

Effective Cu surface pre-treatment for high-reliable 22nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k=2.2)

(2011) F. Ito et al.   MICROELECTRONIC ENGINEERING

Development of low-k precursors for next generation IC manufacturing

(2011) François Doniat et al.   MICROELECTRONIC ENGINEERING

Competition between the buckling-driven delamination and wrinkling in compressed thin coatings

(2011) S. Tarasovs et al.   MICROELECTRONICS RELIABILITY

Morphology and thermal stability of AlF3 thin films grown on Cu(100)

(2011) G. Ruano et al.   SURFACE SCIENCE

Thermal conductivity and sound velocity measurements of plasma enhanced chemical vapor deposited a-SiC:H thin films

(2011) D.B. Hondongwa et al.   THIN SOLID FILMS

Electrical and physical characteristics for crystalline atomic layer deposited beryllium oxide thin film on Si and GaAs substrates

(2011) J.H. Yum et al.   THIN SOLID FILMS

Cu penetration into low-k dielectric during deposition and bias-temperature stress

(2010) Ming He et al.   APPLIED PHYSICS LETTERS

Observation of space charge limited current by Cu ion drift in porous low-k/Cu interconnects

(2010) L. S. Chen et al.   APPLIED PHYSICS LETTERS

Ultraviolet radiation effects on paramagnetic defects in low-κ dielectrics for ultralarge scale integrated circuit interconnects

(2010) B. C. Bittel et al.   APPLIED PHYSICS LETTERS

Deposition of thin films of organic–inorganic hybrid materials based on aromatic carboxylic acids by atomic layer deposition

(2010) Karina Barnholt Klepper et al.   DALTON TRANSACTIONS

Investigation of Moisture Uptake in Low-$\kappa$ Dielectric Materials

(2010) Christoph Kubasch et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Novel Precursor for Development of Si–C2H4–Si Networks in SiCH for Application as a Low-kCap Layer beyond 22 nm Nodes

(2010) Hideharu Shimizu et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Crosslinking of porous SiOCH films involving Si–O–C bonds: Impact of deposition and curing

(2010) O. Gourhant et al.   JOURNAL OF APPLIED PHYSICS

Metal–dielectric interface toughening by molecular nanolayer decomposition

(2010) Saurabh Garg et al.   JOURNAL OF APPLIED PHYSICS

Stress gradients observed in Cu thin films induced by capping layers

(2010) Conal E. Murray et al.   JOURNAL OF MATERIALS RESEARCH

A comparative study of a new microscale technique and conventional bending techniques for evaluating the interface adhesion strength in IC metallization systems

(2010) Shoji Kamiya et al.   JOURNAL OF MATERIALS RESEARCH

Effects of He Plasma Pretreatment on Low-k Damage during Cu Surface Cleaning with NH[sub 3] Plasma

(2010) A. M. Urbanowicz et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Thermal Stress Control in Cu Dual Damascene Interconnects with Low-k Organic Polymer Film

(2010) Masayoshi Tagami et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Atomic Layer Deposition and Characterization of Aluminum Silicate Thin Films for Optical Applications

(2010) Jani Hämäläinen et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Processing and moisture effects on TDDB for Cu/ULK BEOL structures

(2010) E.G. Liniger et al.   MICROELECTRONIC ENGINEERING

Study of metal adhesion on porous low-k dielectric using telephone cord buckling

(2010) M. He et al.   MICROELECTRONICS RELIABILITY

Micron-sized fracture experiments on amorphous SiOx films and SiOx/SiNx multi-layers

(2010) Kurt Matoy et al.   THIN SOLID FILMS

Porogen residues detection in optical properties of low-k dielectrics cured by ultraviolet radiation

(2010) Premysl Marsik et al.   THIN SOLID FILMS

Intrinsic stress effect on fracture toughness of plasma enhanced chemical vapor deposited SiNx:H films

(2010) Sean King et al.   THIN SOLID FILMS

Thermomechanical properties of aluminum alkoxide (alucone) films created using molecular layer deposition

(2009) David C. Miller et al.   ACTA MATERIALIA

Depth-profiling of elastic inhomogeneities in transparent nanoporous low-k materials by picosecond ultrasonic interferometry

(2009) C. Mechri et al.   APPLIED PHYSICS LETTERS

Low Dielectric Constant Materials

(2009) Willi Volksen et al.   CHEMICAL REVIEWS

Challenges for Rechargeable Li Batteries†

(2009) John B. Goodenough et al.   CHEMISTRY OF MATERIALS

Performance Modeling of Low-$k$/Cu Interconnects for 32-nm-Node and Beyond

(2009) Munehiro Tada et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

A model for electric degradation of interconnect low-k dielectrics in microelectronic integrated circuits

(2009) Gaddi S. Haase   JOURNAL OF APPLIED PHYSICS

Elastic modulus of low- k dielectric thin films measured by load-dependent contact-resonance atomic force microscopy

(2009) Gheorghe Stan et al.   JOURNAL OF MATERIALS RESEARCH

The effect of porogen loading on the stiffness and fracture energy of brittle organosilicates

(2009) Han Li et al.   JOURNAL OF MATERIALS RESEARCH

Stress-corrosion mechanisms in silicate glasses

(2009) Matteo Ciccotti   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Silane Decomposition on Cu Interconnects Inhibited by Ammonia

(2009) E. Todd Ryan et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

The evolution of optical and electrical properties of low-k dielectrics under bias stress

(2009) J.M. Atkin et al.   MICROELECTRONIC ENGINEERING

Mapping of elastic modulus at sub-micrometer scale with acoustic contact resonance AFM

(2009) F. Mège et al.   MICROELECTRONIC ENGINEERING

Intrinsic stress fracture energy measurements for PECVD thin films in the SiOxCyNz:H system

(2009) S.W. King et al.   MICROELECTRONICS RELIABILITY

Oxidation resistance of thin boron carbo-nitride films on Ge(100) and Ge nanowires

(2009) P.R. Fitzpatrick et al.   THIN SOLID FILMS

Molecular Layer Deposition of Alucone Polymer Films Using Trimethylaluminum and Ethylene Glycol

(2008) A. A. Dameron et al.   CHEMISTRY OF MATERIALS

Application of Deuterium Exchange to Analyze Moisture Uptake Characteristics of Porous Low-Dielectric-Constant SiOCH Films

(2008) Ekaterina Vinogradova et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Modeling the stress enhancement of plasma enhanced chemical vapor deposited silicon nitride films by UV post treatment – impact of the film density

(2008) P. Morin et al.   EUROPEAN PHYSICAL JOURNAL-APPLIED PHYSICS

Resist Poisoning Studies of Gap Fill Materials for Patterning Metal Trenches in Via-First Dual Damascene Process

(2008) Satoshi Takei   JAPANESE JOURNAL OF APPLIED PHYSICS

Alternative Photoresist Removal Process to Minimize Damage of Low-kMaterial Induced by Ash Plasma

(2008) Quoc Toan Le et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Developments of Plasma Etching Technology for Fabricating Semiconductor Devices

(2008) Haruhiko Abe et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Influence of absorbed water components on SiOCH low-k reliability

(2008) Yunlong Li et al.   JOURNAL OF APPLIED PHYSICS

Property modifications of nanoporous pSiCOH dielectrics to enhance resistance to plasma-induced damage

(2008) E. Todd Ryan et al.   JOURNAL OF APPLIED PHYSICS

Copper ion drift in integrated circuits: Effect of boundary conditions on reliability and breakdown of low-k dielectrics

(2008) Ravi S. Achanta et al.   JOURNAL OF APPLIED PHYSICS

Effects of UV cure on glass structure and fracture properties of nanoporous carbon-doped oxide thin films

(2008) David M. Gage et al.   JOURNAL OF APPLIED PHYSICS

Effect of UV anneal on plasma CVD low-k film

(2008) Yoshimi Shioya et al.   JOURNAL OF NON-CRYSTALLINE SOLIDS

Ab initiocalculation of lattice dynamics in BeO

(2008) Munima B Sahariah et al.   JOURNAL OF PHYSICS-CONDENSED MATTER

Optical Property Changes in Low-k Films upon Ultraviolet-Assisted Curing

(2008) Salvador Eslava et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Ultraviolet-Assisted Curing of Organosilicate Glass Low-k Dielectric by Excimer Lamps

(2008) Salvador Eslava et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Methods of producing plasma enhanced chemical vapor deposition silicon nitride thin films with high compressive and tensile stress

(2008) M. Belyansky et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Mechanistic study of plasma damage of low k dielectric surfaces

(2008) J. Bao et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B

A comparative study on the measurement of toughness of stacks containing low-k dielectric films

(2008) Z.W. Zheng et al.   MICROELECTRONIC ENGINEERING

Screening self-assembled monolayers as Cu diffusion barriers

(2008) A. Maestre Caro et al.   MICROELECTRONIC ENGINEERING

Effect of plasma treatments on interface adhesion between SiOCH ultra-low-k film and SiCN etch stop layer

(2008) Hung-Chun Tsai et al.   MICROELECTRONIC ENGINEERING

Thermal conductivity measurements of low-k films using thermoreflectance phenomenon

(2008) M. Kuwahara et al.   MICROELECTRONIC ENGINEERING

Overview of dual damascene integration schemes in Cu BEOL integration

(2008) J. Kriz et al.   MICROELECTRONIC ENGINEERING

A copper-dielectric cap interface with high resistance to electromigration for high performance semiconductor devices

(2008) J. Hohage et al.   MICROELECTRONIC ENGINEERING

Thermal conductivity of low-k films of varying porosity and direct measurements on silicon substrate

(2008) M. Kuwahara et al.   MICROELECTRONIC ENGINEERING

Cu/low-k dielectric TDDB reliability issues for advanced CMOS technologies

(2008) F. Chen et al.   MICROELECTRONICS RELIABILITY

Impermeable Atomic Membranes from Graphene Sheets

(2008) J. Scott Bunch et al.   NANO LETTERS

Analysis of thermal parameters and factors acting on thermal conduction of low-k films

(2008) Shigeo Sato et al.   SURFACE AND INTERFACE ANALYSIS

Celebrating the 100th anniversary of the Stoney equation for film stress: Developments from polycrystalline steel strips to single crystal silicon wafers

(2008) G.C.A.M. Janssen et al.   THIN SOLID FILMS

Effect of plasma treatments on interface chemistry and adhesion strength between porous SiO2 low-k film and SiC/SiN layers

(2007) Shou-Yi Chang et al.   MICROELECTRONIC ENGINEERING

Copper ion diffusion in porous and nonporous SiO2-based dielectrics using bias thermal stress and thermal stress tests

(2007) I. Fisher et al.   THIN SOLID FILMS