Copper ion diffusion in porous and nonporous SiO2-based dielectrics using bias thermal stress and thermal stress tests

Published 2007 View Full Article

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Title
Copper ion diffusion in porous and nonporous SiO2-based dielectrics using bias thermal stress and thermal stress tests
Authors
Keywords
-
Journal
THIN SOLID FILMS
Volume 516, Issue 12, Pages 4111-4121
Publisher
Elsevier BV
Online
2007-10-30
DOI
10.1016/j.tsf.2007.10.011

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