Effect of low-frequency radio frequency on plasma-enhanced chemical vapor deposited ultra low-κ dielectric films for very large-scale integrated interconnects

Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art

(2014) Alfred Grill et al.   Applied Physics Reviews

Plasma processing of low-k dielectrics

(2013) Mikhail R. Baklanov et al.   JOURNAL OF APPLIED PHYSICS

The effect of VUV radiation from Ar/O2plasmas on low-kSiOCH films

(2011) J Lee et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Stiffening of organosilicate glasses by organic cross-linking

(2010) Han Li et al.   ACTA MATERIALIA

Crosslinking of porous SiOCH films involving Si–O–C bonds: Impact of deposition and curing

(2010) O. Gourhant et al.   JOURNAL OF APPLIED PHYSICS

Improving mechanical robustness of ultralow-k SiOCH plasma enhanced chemical vapor deposition glasses by controlled porogen decomposition prior to UV-hardening

(2010) A. M. Urbanowicz et al.   JOURNAL OF APPLIED PHYSICS

Porous pSiCOH Ultralow-kDielectrics for Chip Interconnects Prepared by PECVD

(2009) Alfred Grill   Annual Review of Materials Research

Effect of Porogen Residue on Chemical, Optical, and Mechanical Properties of CVD SiCOH Low-k Materials

(2009) Adam M. Urbanowicz et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Oxygen radical and plasma damage of low-k organosilicate glass materials: Diffusion-controlled mechanism for carbon depletion

(2009) M. A. Goldman et al.   JOURNAL OF APPLIED PHYSICS

The effect of porogen loading on the stiffness and fracture energy of brittle organosilicates

(2009) Han Li et al.   JOURNAL OF MATERIALS RESEARCH

Adjusting the Skeleton and Pore Structure of Porous SiCOH Dielectrics

(2009) S. M. Gates et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Property modifications of nanoporous pSiCOH dielectrics to enhance resistance to plasma-induced damage

(2008) E. Todd Ryan et al.   JOURNAL OF APPLIED PHYSICS

Optical Property Changes in Low-k Films upon Ultraviolet-Assisted Curing

(2008) Salvador Eslava et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY