Synergistic combinations of dielectrics and metallization process technology to achieve 22nm interconnect performance targets

Title
Synergistic combinations of dielectrics and metallization process technology to achieve 22nm interconnect performance targets
Authors
Keywords
-
Journal
MICROELECTRONIC ENGINEERING
Volume 92, Issue -, Pages 9-14
Publisher
Elsevier BV
Online
2011-04-21
DOI
10.1016/j.mee.2011.04.035

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