Cu Contamination of the nMOSFET in a 3-D Integrated Circuit under Thermal and Electrical Stress

Published 2012 View Full Article

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Title
Cu Contamination of the nMOSFET in a 3-D Integrated Circuit under Thermal and Electrical Stress
Authors
Keywords
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Journal
ELECTROCHEMICAL AND SOLID STATE LETTERS
Volume 15, Issue 5, Pages H157
Publisher
The Electrochemical Society
Online
2012-02-29
DOI
10.1149/2.018205esl
References
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