Thermal Conductivity Measurement of Low-k Dielectric Films: Effect of Porosity and Density

Tunable Plasticity in Amorphous Silicon Carbide Films

(2013) Yusuke Matsuda et al.   ACS Applied Materials & Interfaces

Structural size and temperature dependence of solid to air heat transfer

(2013) M.T. Alam et al.   INTERNATIONAL JOURNAL OF THERMAL SCIENCES

Ca K-edge X-ray absorption fine structure in BaTiO3-CaTiO3 solid solutions

(2013) V. Krayzman et al.   JOURNAL OF APPLIED PHYSICS

Noncontact optical metrologies for Young’s modulus measurements of nanoporous low-k dielectric thin films

(2013) Brian C. Daly et al.   Journal of Nanophotonics

Minimum thermal conductivity considerations in aerogel thin films

(2012) Patrick E. Hopkins et al.   JOURNAL OF APPLIED PHYSICS

Conventional thermal annealing for a more efficient p-type doping of Al+ implanted 4H-SiC

(2012) Roberta Nipoti et al.   JOURNAL OF MATERIALS RESEARCH

Mechanical properties of high porosity low-kdielectric nano-films determined by Brillouin light scattering

(2012) S Bailey et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Tailored amorphous silicon carbide barrier dielectrics by nitrogen and oxygen doping

(2012) Yusuke Matsuda et al.   THIN SOLID FILMS

Film Property Requirements for Hermetic Low-k a-SiOxCyNz:H Dielectric Barriers

(2012) S. W. King et al.   ECS Journal of Solid State Science and Technology

Elastic properties of porous low-k dielectric nano-films

(2011) W. Zhou et al.   JOURNAL OF APPLIED PHYSICS

Intrinsic stress effect on fracture toughness of plasma enhanced chemical vapor deposited SiNx:H films

(2010) Sean King et al.   THIN SOLID FILMS

Thermal conductivity of cubic and hexagonal mesoporous silica thin films

(2009) Thomas Coquil et al.   JOURNAL OF APPLIED PHYSICS

Thermal conductivity measurements of low-k films using thermoreflectance phenomenon

(2008) M. Kuwahara et al.   MICROELECTRONIC ENGINEERING

Thermal conductivity of low-k films of varying porosity and direct measurements on silicon substrate

(2008) M. Kuwahara et al.   MICROELECTRONIC ENGINEERING

Withdrawn: Analysis of thermal parameters and factors acting on thermal conduction of low-k films

(2008) Shigeo Sato et al.   SURFACE AND INTERFACE ANALYSIS