Thermal Stress Control in Cu Dual Damascene Interconnects with Low-k Organic Polymer Film

Authors

Keywords

Journal

Volume 157, Issue 12, Pages H1071

Publisher

The Electrochemical Society

Online

2010-11-09

DOI

10.1149/1.3486808

References

View 2 related references

Explore over 38,000 international journals covering a vast array of academic fields.

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now