Cu penetration into low-k dielectric during deposition and bias-temperature stress

Published 2010 View Full Article

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Title
Cu penetration into low-k dielectric during deposition and bias-temperature stress
Authors
Keywords
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Journal
APPLIED PHYSICS LETTERS
Volume 97, Issue 25, Pages 252901
Publisher
AIP Publishing
Online
2010-12-21
DOI
10.1063/1.3529492
References
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