Plasma processing of low-k dielectrics

Post Porosity Plasma Protection: Scaling of Efficiency with Porosity

(2012) Theo Frot et al.   ADVANCED FUNCTIONAL MATERIALS

Impact of Hydrocarbon Control in Ultraviolet-Assisted Restoration Process for Extremely Porous Plasma Enhanced Chemical Vapor Deposition SiOCH Films with $k = 2.0$

(2012) Yosuke Kimura et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Damage by radicals and photons during plasma cleaning of porous low-k SiOCH. II. Water uptake and change in dielectric constant

(2012) Juline Shoeb et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Damage by radicals and photons during plasma cleaning of porous low-k SiOCH. I. Ar/O2 and He/H2 plasmas

(2012) Juline Shoeb et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Application of the Protection/Deprotection Strategy to the Science of Porous Materials

(2011) Theo Frot et al.   ADVANCED MATERIALS

The nature of the defects generated from plasma exposure in pristine and ultraviolet-cured low-k organosilicate glass

(2011) H. Ren et al.   APPLIED PHYSICS LETTERS

A brief review of dual-frequency capacitively coupled discharges

(2011) Zhen-hua Bi et al.   CURRENT APPLIED PHYSICS

Improvement of Uniformity and Reliability of Scaled-Down Cu Interconnects with Carbon-Rich Low-kFilms

(2011) Ippei Kume et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Advanced Organic Polymer for the Aggressive Scaling of Low-kMaterials

(2011) Marianna Pantouvaki et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

H2/N2 plasma damage on porous dielectric SiOCH film evaluated by in situ film characterization and plasma diagnostics

(2011) Hiroshi Yamamoto et al.   JOURNAL OF APPLIED PHYSICS

The effect of He plasma treatment on properties of organosilicate glass low-k films

(2011) O. V. Braginsky et al.   JOURNAL OF APPLIED PHYSICS

Chemical bond modification in porous SiOCH films by H2 and H2/N2 plasmas investigated by in situ infrared reflection absorption spectroscopy

(2011) Hiroshi Yamamoto et al.   JOURNAL OF APPLIED PHYSICS

Mechanism of plasma-induced damage to low-k SiOCH films during plasma ashing of organic resists

(2011) Keigo Takeda et al.   JOURNAL OF APPLIED PHYSICS

He plasma pretreatment effects on oxygen plasma-induced carbon loss and surface roughening in an ultralow-korganosilicate glass film

(2011) Swayambhu P Behera et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Effects of vacuum ultraviolet radiation on deposited and ultraviolet-cured low-k porous organosilicate glass

(2011) H. Sinha et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Critical review: Plasma-surface reactions and the spinning wall method

(2011) V. M. Donnelly et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Mechanisms for sealing of porous low-k SiOCH by combined He and NH3 plasma treatment

(2011) Juline Shoeb et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Electron spin resonance study of defects in low-κ oxide insulators (κ=2.5–2.0)

(2011) V.V. Afanas’ev et al.   MICROELECTRONIC ENGINEERING

Influence of porosity on electrical properties of low-k dielectrics

(2011) Els Van Besien et al.   MICROELECTRONIC ENGINEERING

Cryogenic plasmas for controlled processing of nanoporous materials

(2011) Francesca Iacopi et al.   PHYSICAL CHEMISTRY CHEMICAL PHYSICS

Saturation of front propagation in a reaction diffusion process describing plasma damage in porous low-kmaterials

(2011) Soghra Safaverdi et al.   PHYSICAL REVIEW B

Interaction of vacuum ultraviolet light with a low-k organosilicate glass film in the presence of NH3

(2010) Swayambhu Behera et al.   APPLIED PHYSICS LETTERS

Ultraviolet radiation effects on paramagnetic defects in low-κ dielectrics for ultralarge scale integrated circuit interconnects

(2010) B. C. Bittel et al.   APPLIED PHYSICS LETTERS

Hard-Mask-Through UV-Light-Induced Damage to Low-kFilm during Plasma Process for Dual Damascene

(2010) Noriaki Matsunaga et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Plasma damage effects on low-k porous organosilicate glass

(2010) H. Ren et al.   JOURNAL OF APPLIED PHYSICS

Roughening of porous SiCOH materials in fluorocarbon plasmas

(2010) F. Bailly et al.   JOURNAL OF APPLIED PHYSICS

Improving mechanical robustness of ultralow-k SiOCH plasma enhanced chemical vapor deposition glasses by controlled porogen decomposition prior to UV-hardening

(2010) A. M. Urbanowicz et al.   JOURNAL OF APPLIED PHYSICS

Prediction of UV spectra and UV-radiation damage in actual plasma etching processes using on-wafer monitoring technique

(2010) Butsurin Jinnai et al.   JOURNAL OF APPLIED PHYSICS

The mechanism of low-k SiOCH film modification by oxygen atoms

(2010) O. V. Braginsky et al.   JOURNAL OF APPLIED PHYSICS

Etching characteristics of organic low-k films interpreted by internal parameters employing a combinatorial plasma process in an inductively coupled H2/N2 plasma

(2010) Chang Sung Moon et al.   JOURNAL OF APPLIED PHYSICS

Charging and the secondary electron–electron emission on a trench surface: broadening and shift of ion energy spectrum at plasma trench etching

(2010) A P Palov et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Synergistic damage effects of vacuum ultraviolet photons and O2in SiCOH ultra-low-kdielectric films

(2010) J Lee et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Chemical Repair of Plasma Damaged Porous Ultra Low-κ SiOCH Film Using a Vapor Phase Process

(2010) Thomas Oszinda et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Effects of He Plasma Pretreatment on Low-k Damage during Cu Surface Cleaning with NH[sub 3] Plasma

(2010) A. M. Urbanowicz et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Adhesion Degradation and Water Diffusion in Nanoporous Organosilicate Glass Thin Film Stacks

(2010) Youbo Lin et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Charge Trapping within UV and Vacuum UV Irradiated Low-k Porous Organosilicate Dielectrics

(2010) J. L. Lauer et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Oxygen plasma damage to blanket and patterned ultralow-κ surfaces

(2010) J. Bao et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Reflectance and substrate currents of dielectric layers under vacuum ultraviolet irradiation

(2010) H. Sinha et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Active species in porous media: Random walk and capture in traps

(2010) V.E. Arkhincheev et al.   MICROELECTRONIC ENGINEERING

Integrated diffusion–recombination model for describing the logarithmic time dependence of plasma damage in porous low-k materials

(2010) E. Kunnen et al.   MICROELECTRONIC ENGINEERING

Effect of porogen residue on electrical characteristics of ultra low-k materials

(2010) Mikhail R. Baklanov et al.   MICROELECTRONIC ENGINEERING

Influence of the additives argon, O2, C4F8, H2, N2 and CO on plasma conditions and process results during the etch of SiCOH in CF4 plasma

(2010) S. Zimmermann et al.   MICROELECTRONIC ENGINEERING

Porogen residues detection in optical properties of low-k dielectrics cured by ultraviolet radiation

(2010) Premysl Marsik et al.   THIN SOLID FILMS

Application of scatterometric porosimetry to characterize porous ultra low-k patterned layers

(2010) C. Licitra et al.   THIN SOLID FILMS

Porous Dielectrics in Microelectronic Wiring Applications

(2010) Vincent McGahay   Materials

Fundamental mechanisms of oxygen plasma-induced damage of ultralow-k organosilicate materials: The role of thermal P3 atomic oxygen

(2009) Mrunalkumar Chaudhari et al.   APPLIED PHYSICS LETTERS

Effect of Porogen Residue on Chemical, Optical, and Mechanical Properties of CVD SiCOH Low-k Materials

(2009) Adam M. Urbanowicz et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Recombination of O and H Atoms on the Surface of Nanoporous Dielectrics

(2009) T.V. Rakhimova et al.   IEEE TRANSACTIONS ON PLASMA SCIENCE

Effects of silylation on fracture and mechanical properties of mesoporous silica films interfaced with copper

(2009) D. D. Gandhi et al.   JOURNAL OF APPLIED PHYSICS

Oxygen radical and plasma damage of low-k organosilicate glass materials: Diffusion-controlled mechanism for carbon depletion

(2009) M. A. Goldman et al.   JOURNAL OF APPLIED PHYSICS

Water diffusion and fracture behavior in nanoporous low-k dielectric film stacks

(2009) Han Li et al.   JOURNAL OF APPLIED PHYSICS

Evaluation of Property Changes due to Radiation, Radicals, and Ions on Organic Low-kFilms in H2/N2Plasma Etching

(2008) Saburo Uchida et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Effects of Etch Rate on Plasma-Induced Damage to Porous Low-kFilms

(2008) Yoshihisa Iba et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Influence of absorbed water components on SiOCH low-k reliability

(2008) Yunlong Li et al.   JOURNAL OF APPLIED PHYSICS

Property modifications of nanoporous pSiCOH dielectrics to enhance resistance to plasma-induced damage

(2008) E. Todd Ryan et al.   JOURNAL OF APPLIED PHYSICS

Plasma damage mechanisms for low-k porous SiOCH films due to radiation, radicals, and ions in the plasma etching process

(2008) Saburo Uchida et al.   JOURNAL OF APPLIED PHYSICS

Optical Property Changes in Low-k Films upon Ultraviolet-Assisted Curing

(2008) Salvador Eslava et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Low-damage low-k etching with an environmentally friendly CF3I plasma

(2008) Eiichi Soda et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Surface roughening of silicon, thermal silicon dioxide, and low-k dielectric coral films in argon plasma

(2008) Yunpeng Yin et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Mechanistic study of plasma damage of low k dielectric surfaces

(2008) J. Bao et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B

Reaction of Trimethylchlorosilane in Spin-On Silicalite-1 Zeolite Film

(2008) Salvador Eslava et al.   LANGMUIR

Effect of plasma treatments on interface adhesion between SiOCH ultra-low-k film and SiCN etch stop layer

(2008) Hung-Chun Tsai et al.   MICROELECTRONIC ENGINEERING

Effect of pressure on efficiency of UV curing of CVD-derived low-k material at different wavelengths

(2008) L. Prager et al.   MICROELECTRONIC ENGINEERING