Mechanisms for sealing of porous low-k SiOCH by combined He and NH3 plasma treatment

Interaction of vacuum ultraviolet light with a low-k organosilicate glass film in the presence of NH3

(2010) Swayambhu Behera et al.   APPLIED PHYSICS LETTERS

The mechanism of low-k SiOCH film modification by oxygen atoms

(2010) O. V. Braginsky et al.   JOURNAL OF APPLIED PHYSICS

Effects of He Plasma Pretreatment on Low-k Damage during Cu Surface Cleaning with NH[sub 3] Plasma

(2010) A. M. Urbanowicz et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Hybrid modelling of low temperature plasmas for fundamental investigations and equipment design

(2009) Mark J Kushner   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Plasma atomic layer etching using conventional plasma equipment

(2009) Ankur Agarwal et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

32nm node BEOL integration with an extreme low-k porous SiOCH dielectric k=2.3

(2009) K. Hamioud et al.   MICROELECTRONIC ENGINEERING

Influence of NH3 plasma treatment on chemical bonding and water adsorption of low-k SiCOH film

(2008) Hao-Wen Guo et al.   MICROELECTRONIC ENGINEERING