Bias polarity and frequency effects of Cu-induced dielectric breakdown in damascene Cu interconnects

Title
Bias polarity and frequency effects of Cu-induced dielectric breakdown in damascene Cu interconnects
Authors
Keywords
-
Journal
MICROELECTRONIC ENGINEERING
Volume 89, Issue -, Pages 58-61
Publisher
Elsevier BV
Online
2011-02-10
DOI
10.1016/j.mee.2011.01.070

Ask authors/readers for more resources

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now