Effects of Post-CMP Cleaning on Time Dependent Dielectric Breakdown and Electro-Migration in Porous Low-k∕Cu Interconnects

Authors

Keywords

Journal

Volume 158, Issue 11, Pages H1133

Publisher

The Electrochemical Society

Online

2011-10-06

DOI

10.1149/2.033111jes

References

View 4 related references

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