Defect structure and electronic properties of SiOC:H films used for back end of line dielectrics

High-resolution electron spin resonance analysis of ion bombardment induced defects in advanced low-κ insulators (κ = 2.0-2.5)

(2013) V. V. Afanas'ev et al.   APPLIED PHYSICS LETTERS

Study of viscoplastic deformation in porous organosilicate thin films for ultra low-k applications

(2013) Emil H. Zin et al.   APPLIED PHYSICS LETTERS

Correlation between field dependent electrical conduction and dielectric breakdown in a SiCOH based low-k (k = 2.0) dielectric

(2013) C. Wu et al.   APPLIED PHYSICS LETTERS

Modelization of structural changes in ultra low k materials during ultraviolet cure

(2013) G. Imbert et al.   JOURNAL OF APPLIED PHYSICS

The effects of plasma exposure and vacuum ultraviolet irradiation on photopatternable low-k dielectric materials

(2013) M. T. Nichols et al.   JOURNAL OF APPLIED PHYSICS

Defects and electronic transport in hydrogenated amorphous SiC films of interest for low dielectric constant back end of the line dielectric systems

(2013) T. A. Pomorski et al.   JOURNAL OF APPLIED PHYSICS

Detection of defect states in low-k dielectrics using reflection electron energy loss spectroscopy

(2013) S.W. King et al.   JOURNAL OF APPLIED PHYSICS

Detection of surface electronic defect states in low and high-k dielectrics using reflection electron energy loss spectroscopy

(2013) Benjamin L. French et al.   JOURNAL OF MATERIALS RESEARCH

The effect of the pore topology on the elastic modulus of organosilicate glasses

(2013) Kong-Boon Yeap et al.   JOURNAL OF MATERIALS RESEARCH

Influence of network bond percolation on the thermal, mechanical, electrical and optical properties of high and low-k a-SiC:H thin films

(2013) Sean W. King et al.   JOURNAL OF NON-CRYSTALLINE SOLIDS

Research Updates: The three M's (materials, metrology, and modeling) together pave the path to future nanoelectronic technologies

(2013) Sean W. King et al.   APL Materials

Time-dependent dielectric breakdown of plasma-exposed porous organosilicate glass

(2012) M. T. Nichols et al.   APPLIED PHYSICS LETTERS

Validation of a correction procedure for removing the optical effects from transmission spectra of thin films on substrates

(2012) Milan Milosevic et al.   JOURNAL OF APPLIED PHYSICS

A method to extract absorption coefficient of thin films from transmission spectra of the films on thick substrates

(2012) Sean W. King et al.   JOURNAL OF APPLIED PHYSICS

The effects of vacuum ultraviolet radiation on low-kdielectric films

(2012) H. Sinha et al.   JOURNAL OF APPLIED PHYSICS

Mechanical properties of high porosity low-kdielectric nano-films determined by Brillouin light scattering

(2012) S Bailey et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Film Property Requirements for Hermetic Low-k a-SiOxCyNz:H Dielectric Barriers

(2012) S. W. King et al.   ECS Journal of Solid State Science and Technology

Defects in low-k organosilicate glass and their response to processing as measured with electron-spin resonance

(2011) H. Ren et al.   APPLIED PHYSICS LETTERS

The nature of the defects generated from plasma exposure in pristine and ultraviolet-cured low-k organosilicate glass

(2011) H. Ren et al.   APPLIED PHYSICS LETTERS

X-ray photoelectron spectroscopy investigation of the Schottky barrier at low-k a-SiO(C):H/Cu interfaces

(2011) S. W. King et al.   APPLIED PHYSICS LETTERS

Fourier transform infrared spectroscopy investigation of chemical bonding in low-k a-SiC:H thin films

(2011) S.W. King et al.   JOURNAL OF NON-CRYSTALLINE SOLIDS

Mass and bond density measurements for PECVD a-SiCx:H thin films using Fourier transform-infrared spectroscopy

(2011) S.W. King et al.   JOURNAL OF NON-CRYSTALLINE SOLIDS

Effect of vacuum ultraviolet and ultraviolet irradiation on mobile charges in the bandgap of low-k-porous organosilicate dielectrics

(2011) H. Sinha et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Effects of vacuum ultraviolet radiation on deposited and ultraviolet-cured low-k porous organosilicate glass

(2011) H. Sinha et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Electron spin resonance study of defects in low-κ oxide insulators (κ=2.5–2.0)

(2011) V.V. Afanas’ev et al.   MICROELECTRONIC ENGINEERING

Influence of porosity on electrical properties of low-k dielectrics

(2011) Els Van Besien et al.   MICROELECTRONIC ENGINEERING

Synergistic combinations of dielectrics and metallization process technology to achieve 22nm interconnect performance targets

(2011) G.A. Antonelli et al.   MICROELECTRONIC ENGINEERING

Development of low-k precursors for next generation IC manufacturing

(2011) François Doniat et al.   MICROELECTRONIC ENGINEERING

Surface potential due to charge accumulation during vacuum ultraviolet exposure for high-k and low-k dielectrics

(2010) H. Ren et al.   APPLIED PHYSICS LETTERS

Ultraviolet radiation effects on paramagnetic defects in low-κ dielectrics for ultralarge scale integrated circuit interconnects

(2010) B. C. Bittel et al.   APPLIED PHYSICS LETTERS

Limitations of Poole–Frenkel Conduction in Bilayer $\hbox{HfO}_{2}/\hbox{SiO}_{2}$ MOS Devices

(2010) Richard G. Southwick et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Plasma damage effects on low-k porous organosilicate glass

(2010) H. Ren et al.   JOURNAL OF APPLIED PHYSICS

Crosslinking of porous SiOCH films involving Si–O–C bonds: Impact of deposition and curing

(2010) O. Gourhant et al.   JOURNAL OF APPLIED PHYSICS

Effect of ultraviolet cure on the interfacial toughness and structure of SiOC thin film on Si substrate

(2010) M. Takeda et al.   JOURNAL OF MATERIALS RESEARCH

Ultralow-k/Cu Damascene Multilevel Interconnects Using High Porosity and High Modulus Self-Assembled Porous Silica

(2010) Shinichi Chikaki et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Charge Trapping within UV and Vacuum UV Irradiated Low-k Porous Organosilicate Dielectrics

(2010) J. L. Lauer et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Paramagnetic Defect Generation and Microstructure Change in Porous Low-k SiOCH Films with Vacuum Baking

(2010) Kenji Tanbara et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Effect of porogen residue on electrical characteristics of ultra low-k materials

(2010) Mikhail R. Baklanov et al.   MICROELECTRONIC ENGINEERING

Porogen residues detection in optical properties of low-k dielectrics cured by ultraviolet radiation

(2010) Premysl Marsik et al.   THIN SOLID FILMS

Low Dielectric Constant Materials

(2009) Willi Volksen et al.   CHEMICAL REVIEWS

Effect of Porogen Residue on Chemical, Optical, and Mechanical Properties of CVD SiCOH Low-k Materials

(2009) Adam M. Urbanowicz et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

A model for electric degradation of interconnect low-k dielectrics in microelectronic integrated circuits

(2009) Gaddi S. Haase   JOURNAL OF APPLIED PHYSICS

Effects of ultraviolet radiation on ultra-low-dielectric constant thin film fracture properties

(2009) Ryan Scott Smith et al.   JOURNAL OF MATERIALS RESEARCH

Adjusting the Skeleton and Pore Structure of Porous SiCOH Dielectrics

(2009) S. M. Gates et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

The evolution of optical and electrical properties of low-k dielectrics under bias stress

(2009) J.M. Atkin et al.   MICROELECTRONIC ENGINEERING

Intrinsic stress fracture energy measurements for PECVD thin films in the SiOxCyNz:H system

(2009) S.W. King et al.   MICROELECTRONICS RELIABILITY

Influence of absorbed water components on SiOCH low-k reliability

(2008) Yunlong Li et al.   JOURNAL OF APPLIED PHYSICS

Effects of UV cure on glass structure and fracture properties of nanoporous carbon-doped oxide thin films

(2008) David M. Gage et al.   JOURNAL OF APPLIED PHYSICS

Optical Property Changes in Low-k Films upon Ultraviolet-Assisted Curing

(2008) Salvador Eslava et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Conduction Mechanisms of Ta/Porous SiCOH Films under Electrical Bias

(2008) Ya Ou et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Effect of pressure on efficiency of UV curing of CVD-derived low-k material at different wavelengths

(2008) L. Prager et al.   MICROELECTRONIC ENGINEERING

Electrical conduction and TDDB reliability characterization for low-k SiCO dielectric in Cu interconnects

(2008) Robin C.J. Wang et al.   THIN SOLID FILMS

Chemical–mechanical relationship of amorphous/porous low-dielectric film materials

(2007) C.A. Yuan et al.   COMPUTATIONAL MATERIALS SCIENCE