Material design of plasma-enhanced chemical vapour deposition SiCH films for low-kcap layers in the further scaling of ultra-large-scale integrated devices-Cu interconnects

Characterization of Porous Structures in Advanced Low-kFilms with Thin TaN Layers Using Monoenergetic Positron Beams

(2013) Akira Uedono et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Variation of Chemical Vapor Deposited SiO$_{2}$ Density Due to Generation and Shrinkage of Open Space During Thermal Annealing

(2012) Mitsuru Sometani et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Structure-Modification Model of Porogen-Based Porous SiOC Film with Ultraviolet Curing

(2011) Yoshihiro Oka et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Isobutyl Silane Precursors for SiCH Low-kCap Layer beyond the 22 nm Node: Analysis of Film Structure for Compatibility of Lowerk-value and High Barrier Properties

(2011) Hideharu Shimizu et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Novel Precursors for SiCH Low-$k$ Caps beyond the 22 nm Node: Reactions of Silacyclopentane Precursors in the Plasma-Enhanced Chemical Vapor Deposition Process and Structural Analyses of SiCH Films

(2011) Hideharu Shimizu et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

High-Etching-Selectivity Barrier SiC (k

(2010) Junya Nakahira et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Novel Precursor for Development of Si–C2H4–Si Networks in SiCH for Application as a Low-kCap Layer beyond 22 nm Nodes

(2010) Hideharu Shimizu et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Characterization of Low-k/Cu Damascene Structures Using Monoenergetic Positron Beams

(2009) Akira Uedono et al.   JAPANESE JOURNAL OF APPLIED PHYSICS