Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art

Plasma processing of low-k dielectrics

(2013) Mikhail R. Baklanov et al.   JOURNAL OF APPLIED PHYSICS

In Situ Co/SiC(N,H) Capping Layers for Cu/Low- k Interconnects

(2012) C.-C. Yang et al.   IEEE ELECTRON DEVICE LETTERS

Electromigration in Cu(Al) and Cu(Mn) damascene lines

(2012) C.-K. Hu et al.   JOURNAL OF APPLIED PHYSICS

The effect of VUV radiation from Ar/O2plasmas on low-kSiOCH films

(2011) J Lee et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Porous pSiCOH Ultralow-kDielectrics for Chip Interconnects Prepared by PECVD

(2009) Alfred Grill   Annual Review of Materials Research

Oxygen radical and plasma damage of low-k organosilicate glass materials: Diffusion-controlled mechanism for carbon depletion

(2009) M. A. Goldman et al.   JOURNAL OF APPLIED PHYSICS

Adjusting the Skeleton and Pore Structure of Porous SiCOH Dielectrics

(2009) S. M. Gates et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Ultralow dielectric constant pSiCOH films prepared with tetramethylcyclotetrasiloxane as skeleton precursor

(2008) A. Grill et al.   JOURNAL OF APPLIED PHYSICS

Interface engineering for high interfacial strength between SiCOH and porous SiCOH interconnect dielectrics and diffusion caps

(2008) A. Grill et al.   JOURNAL OF APPLIED PHYSICS

Property modifications of nanoporous pSiCOH dielectrics to enhance resistance to plasma-induced damage

(2008) E. Todd Ryan et al.   JOURNAL OF APPLIED PHYSICS