Intermetallic compounds in 3D integrated circuits technology: a brief review
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Title
Intermetallic compounds in 3D integrated circuits technology: a brief review
Authors
Keywords
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Journal
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS
Volume 18, Issue 1, Pages 693-703
Publisher
Informa UK Limited
Online
2017-09-28
DOI
10.1080/14686996.2017.1364975
References
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