A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding

Published 2015 View Full Article

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Title
A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding
Authors
Keywords
Lead free solder, Intermetallic compound, Wafer bonding, Interfacial reaction
Journal
SCRIPTA MATERIALIA
Volume 109, Issue -, Pages 113-117
Publisher
Elsevier BV
Online
2015-07-28
DOI
10.1016/j.scriptamat.2015.07.032

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