Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints

Interfacial reactions of fine-pitch Cu/Sn–3.5Ag pillar joints on Cu/Zn and Cu/Ni under bump metallurgies

(2014) Mi-Song Kim et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits

(2014) Y. T. Huang et al.   JOURNAL OF APPLIED PHYSICS

Comparison of thermomigration behaviors between Pb-free flip chip solder joints and microbumps in three dimensional integrated circuits: Bump height effect

(2013) Fan-Yi Ouyang et al.   JOURNAL OF APPLIED PHYSICS

The Interphases Formed During the Very Early Stage Liquid Solder/Metal Substrate Interaction of the Soldering Process

(2012) Kwang-Lung Lin et al.   JOM

Correlations between interfacial reactions and bonding strengths of Cu/Sn/Cu pillar bump

(2011) Byung-Hyun Kwak et al.   MICROELECTRONIC ENGINEERING

Effects of annealing and current stressing on the intermetallic compounds growth kinetics of Cu/thin Sn/Cu bump

(2011) Myeong-Hyeok Jeong et al.   MICROELECTRONIC ENGINEERING

Microstructural evolution of the intermetallic compounds in the high density solder interconnects with reduced stand‐off heights

(2011) Bo Wang et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Intermetallic Compound Growth and Reliability of Cu Pillar Bumps Under Current Stressing

(2010) Byoung-Joon Kim et al.   JOURNAL OF ELECTRONIC MATERIALS

Direct evidence for a Cu-enriched region at the boundary between Cu6Sn5 and Cu3Sn during Cu/Sn reaction

(2010) C. Key Chung et al.   SCRIPTA MATERIALIA

Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn–Zn lead-free solder

(2009) Ramani Mayappan et al.   INTERMETALLICS