Electromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints

Effects of Zn addition on electromigration behavior of Sn–1Ag–0.5Cu solder interconnect

(2012) H. Y. Liu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effect of Sn Grain Orientation on the Cu6Sn5 Formation in a Sn-Based Solder Under Current Stressing

(2012) Chih-Fan Lin et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn–Ag–Cu/Cu ball joints

(2011) Kiju Lee et al.   JOURNAL OF MATERIALS RESEARCH

Effects of Co additions on electromigration behaviors in Sn–3.0 Ag–0.5 Cu-based solder joint

(2011) Limin Ma et al.   JOURNAL OF MATERIALS SCIENCE

Formation and behavior of Kirkendall voids within intermetallic layers of solder joints

(2011) Doosoo Kim et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Current stressing-induced growth of Cu3Sn in Cu/Sn/Cu solder joints

(2011) Delphic Chen et al.   MATERIALS LETTERS

Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System

(2011) A. Paul et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Effects of annealing and current stressing on the intermetallic compounds growth kinetics of Cu/thin Sn/Cu bump

(2011) Myeong-Hyeok Jeong et al.   MICROELECTRONIC ENGINEERING

Quantitative X-ray microtomography study of 3-D void growth induced by electromigration in eutectic SnPb flip-chip solder joints

(2011) Tian Tian et al.   SCRIPTA MATERIALIA

Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints

(2010) Chih Chen et al.   Annual Review of Materials Research

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

(2010) K. Sakuma et al.   IBM JOURNAL OF RESEARCH AND DEVELOPMENT

Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu interconnect

(2010) L.D. Chen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces

(2010) H.W. Tseng et al.   MICROELECTRONICS RELIABILITY

Failure mechanisms of solder interconnects under current stressing in advanced electronic packages

(2010) Y.C. Chan et al.   PROGRESS IN MATERIALS SCIENCE

Polarity effect of electromigration on intermetallic compound formation in SnPb solder joints

(2009) Yu-Dong Lu et al.   ACTA MATERIALIA

Electromigration in Sn–Cu intermetallic compounds

(2009) C. C. Wei et al.   JOURNAL OF APPLIED PHYSICS

Effect of small amount of rare earth addition on electromigration in eutectic SnBi solder reaction couple

(2009) Hongwen He et al.   JOURNAL OF MATERIALS SCIENCE

Electromigration behaviors in Sb particle-reinforced composite eutectic SnAgCu solder joints

(2009) Fu Guo et al.   JOURNAL OF MATERIALS SCIENCE

Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints

(2009) Brook Huang-Lin Chao et al.   MICROELECTRONICS RELIABILITY

Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column

(2008) Luhua Xu et al.   APPLIED PHYSICS LETTERS

Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders

(2008) Minhua Lu et al.   APPLIED PHYSICS LETTERS

Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization

(2008) Yi-Shao Lai et al.   JOURNAL OF ELECTRONIC MATERIALS