Effects of Annealing, Thermomigration, and Electromigration on the Intermetallic Compounds Growth Kinetics of Cu/Sn-2.5Ag Microbump

Published 2015 View Full Article

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Title
Effects of Annealing, Thermomigration, and Electromigration on the Intermetallic Compounds Growth Kinetics of Cu/Sn-2.5Ag Microbump
Authors
Keywords
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Journal
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY
Volume 15, Issue 11, Pages 8593-8600
Publisher
American Scientific Publishers
Online
2015-09-10
DOI
10.1166/jnn.2015.11502

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