Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces

Published 2014 View Full Article

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Title
Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces
Authors
Keywords
-
Journal
SCRIPTA MATERIALIA
Volume 78-79, Issue -, Pages 65-68
Publisher
Elsevier BV
Online
2014-02-08
DOI
10.1016/j.scriptamat.2014.01.040

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