Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection

Published 2016 View Full Article

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Title
Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection
Authors
Keywords
Hybrid bonding, Single-micron pitch, Non-conductive film, Chemical mechanical polishing, Underfill, 3D integration
Journal
MICROELECTRONICS RELIABILITY
Volume 59, Issue -, Pages 134-139
Publisher
Elsevier BV
Online
2016-01-13
DOI
10.1016/j.microrel.2015.12.033

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