Material innovation opportunities for 3D integrated circuits from a wireless application point of view

Published 2015 View Full Article

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Title
Material innovation opportunities for 3D integrated circuits from a wireless application point of view
Authors
Keywords
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Journal
MRS BULLETIN
Volume 40, Issue 03, Pages 233-241
Publisher
Cambridge University Press (CUP)
Online
2015-03-10
DOI
10.1557/mrs.2015.9
References
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