Effect of Joint Scale and Processing on the Fracture of Sn-3Ag-0.5Cu Solder Joints: Application to Micro-bumps in 3D Packages

A general methodology for calculating mixed mode stress intensity factors and fracture toughness of solder joints with interfacial cracks

(2014) Z. Huang et al.   ENGINEERING FRACTURE MECHANICS

Effects of Microstructure and Loading on Fracture of Sn-3.8Ag-0.7Cu Joints on Cu Substrates with ENIG Surface Finish

(2014) Z. Huang et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of geometric complexities and nonlinear material properties on interfacial crack behavior in electronic devices

(2014) Koustav Sinha et al.   MICROELECTRONICS RELIABILITY

Nanomechanical characterization of Sn–Ag–Cu/Cu joints—Part 1: Young’s modulus, hardness and deformation mechanisms as a function of temperature

(2013) V.M.F. Marques et al.   ACTA MATERIALIA

Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints

(2013) Z. Huang et al.   JOURNAL OF ELECTRONIC MATERIALS

Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn–3Cu/Cu joints

(2012) L.M. Yang et al.   SCRIPTA MATERIALIA

Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates. II: Fracture Mechanism Map

(2011) P. Kumar et al.   JOURNAL OF ELECTRONIC MATERIALS

Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates: I. Effects of Loading and Processing Conditions

(2011) Z. Huang et al.   JOURNAL OF ELECTRONIC MATERIALS

Correlations between interfacial reactions and bonding strengths of Cu/Sn/Cu pillar bump

(2011) Byung-Hyun Kwak et al.   MICROELECTRONIC ENGINEERING

Effects of annealing and current stressing on the intermetallic compounds growth kinetics of Cu/thin Sn/Cu bump

(2011) Myeong-Hyeok Jeong et al.   MICROELECTRONIC ENGINEERING

Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps

(2009) Gi-Tae Lim et al.   JOURNAL OF ELECTRONIC MATERIALS

Interfacial fracture toughness of Pb-free solders

(2008) S.M. Hayes et al.   MICROELECTRONICS RELIABILITY

Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples

(2007) Ping-Feng Yang et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING