Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu–SnAg Microbumps and a Nonconductive Film

Published 2014 View Full Article

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Title
Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu–SnAg Microbumps and a Nonconductive Film
Authors
Keywords
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Journal
IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume 61, Issue 2, Pages 533-539
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2014-01-25
DOI
10.1109/ted.2013.2294831

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