Effect of Loading Stress on the Growth of Cn/Sn Intermetallic Compounds at High Temperatures

Authors

Keywords

Copper–tin intermetallic compound formation, solder diffusion, micromechanical test

Journal

Volume 44, Issue 1, Pages 604-611

Publisher

Springer Nature

Online

2014-11-15

DOI

10.1007/s11664-014-3503-9

References

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