Optimal Ag addition for the elimination of voids in Ni/SnAg/Ni micro joints for 3D IC applications

Published 2015 View Full Article

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Title
Optimal Ag addition for the elimination of voids in Ni/SnAg/Ni micro joints for 3D IC applications
Authors
Keywords
Micro joints, Ag concentration, Intermetallic compound, Space confinement, Kirkendall effect
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 629, Issue -, Pages 16-21
Publisher
Elsevier BV
Online
2015-01-09
DOI
10.1016/j.jallcom.2015.01.001

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