Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach

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Title
Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach
Authors
Keywords
Intermetallics, Surface and interfaces, Sintering, Diffusion, Phase transitions
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 695, Issue -, Pages 2165-2172
Publisher
Elsevier BV
Online
2016-11-07
DOI
10.1016/j.jallcom.2016.11.064

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