Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates

Published 2014 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 54, Issue 5, Pages 932-938
Publisher
Elsevier BV
Online
2014-01-27
DOI
10.1016/j.microrel.2014.01.008

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.