Interfacial reaction and IMCs growth behavior of Sn3Ag0.5Cu/Ni solder bump during aging at various temperatures

Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration

(2015) M.L. Huang et al.   ACTA MATERIALIA

Effects of Sn thickness on morphology and evolution of Ni3Sn4 grains formed between molten Sn and Ni substrate

(2015) Chao-hong Wang et al.   INTERMETALLICS

Interfacial compounds growth of SnAgCu(nano La 2 O 3 )/Cu solder joints based on experiments and FEM

(2015) Liang Zhang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

A study on the interfacial reaction of Sn58Bi/Cu soldered joints under various cooling and aging conditions

(2015) Xiaowu Hu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Mechanism of volume shrinkage during reaction between Ni and Ag-doped Sn

(2015) C.C. Li et al.   MATERIALS LETTERS

Suppression of void nucleation in Sn3.0Ag0.5Cu/CU solder joint by rapid thermal processing

(2015) Hailong Li et al.   MATERIALS LETTERS

Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints

(2015) H.B. Qin et al.   MICROELECTRONICS RELIABILITY

Growth behavior of interfacial Cu–Sn intermetallic compounds of Sn/Cu reaction couples during dip soldering and aging

(2013) Xiaowu Hu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Sequential interfacial intermetallic compound formation of Cu6Sn5 and Ni3Sn4 between Sn–Ag–Cu solder and ENEPIG substrate during a reflow process

(2011) Jeong-Won Yoon et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Fast Concurrent Growth of Ni3Sn4 and Voids During Solid-State Reaction Between Sn-Rich Solder and Ni Substrates

(2011) Bo-Mook Chung et al.   JOURNAL OF ELECTRONIC MATERIALS

Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints

(2011) Chao Sheng Liu et al.   JOURNAL OF ELECTRONIC MATERIALS

Reaction kinetics of Ni/Sn soldering reaction

(2010) Jens Görlich et al.   ACTA MATERIALIA

Effects of third element and surface finish on interfacial reactions of Sn–Ag–xCu (or Ni)/(Cu or ENIG) solder joints

(2010) Jeong-Won Yoon et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni

(2010) S.C. Yang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction

(2009) J. Shen et al.   ACTA MATERIALIA