Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder

Published 2013 View Full Article

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Title
Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder
Authors
Keywords
-
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 587, Issue -, Pages 32-39
Publisher
Elsevier BV
Online
2013-10-30
DOI
10.1016/j.jallcom.2013.10.148

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