Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints

Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects

(2013) Iuliana Panchenko et al.   MICROELECTRONIC ENGINEERING

Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints

(2012) Y. C. Liang et al.   JOURNAL OF APPLIED PHYSICS

Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish

(2012) Ming-Hui Chu et al.   JOURNAL OF ELECTRONIC MATERIALS

Side Wall Wetting Induced Void Formation due to Small Solder Volume in Microbumps of Ni/SnAg/Ni upon Reflow

(2012) Y. C. Liang et al.   ECS Solid State Letters

Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu

(2011) H.-Y. Hsiao et al.   SCRIPTA MATERIALIA

Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints

(2010) Chih Chen et al.   Annual Review of Materials Research

Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column

(2008) Luhua Xu et al.   APPLIED PHYSICS LETTERS