Interfacial structure and growth kinetics of intermetallic compounds between Sn-3.5Ag solder and Al substrate during solder process

Published 2016 View Full Article

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Title
Interfacial structure and growth kinetics of intermetallic compounds between Sn-3.5Ag solder and Al substrate during solder process
Authors
Keywords
Intermetallic compounds, Growth kinetics, SnAg solder, Al substrate
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 682, Issue -, Pages 627-633
Publisher
Elsevier BV
Online
2016-05-01
DOI
10.1016/j.jallcom.2016.04.263

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