Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces

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Title
Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces
Authors
Keywords
Soldering, Synchrotron radiation, Intermetallic compounds, Phase transformations, Kinetics
Journal
SCRIPTA MATERIALIA
Volume 100, Issue -, Pages 17-20
Publisher
Elsevier BV
Online
2014-12-20
DOI
10.1016/j.scriptamat.2014.11.039

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