Extrusion Suppression of TSV Filling Metal by Cu-W Electroplating for Three-Dimensional Microelectronic Packaging

Fabrication of W–Cu/CeO2 composites with excellent electric conductivity and high strength prepared from copper-coated tungsten and Ceria powders

(2015) Ze-Long Lu et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Through silicon via filling methods with metal/polymer composite for three-dimensional LSI

(2014) Barbara Horváth et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Investigation on mechanism of polymer filling in high-aspect-ratio trenches for through-silicon-via (TSV) application

(2014) YingTao Ding et al.   Science China-Technological Sciences

Effect of W addition on the electroless deposited NiP(W) barrier layer

(2013) Yishi Tao et al.   APPLIED SURFACE SCIENCE

Microstructures and formation mechanism of W–Cu composite coatings on copper substrate prepared by mechanical alloying method

(2013) Yunfei Meng et al.   APPLIED SURFACE SCIENCE

Synthesis, characterization and understanding of the mechanisms of electroplating of nanocrystalline–amorphous nickel–tungsten alloys using in situ electrochemical impedance spectroscopy

(2013) Majid Ahmadi et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Development of lead free pulse electrodeposited tin based composite solder coating reinforced with ex situ cerium oxide nanoparticles

(2013) Ashutosh Sharma et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Fabrication of Sn-Ag/CeO2 Electro-Composite Solder by Pulse Electrodeposition

(2013) Ashutosh Sharma et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Void formation over limiting current density and impurity analysis of TSV fabricated by constant-current pulse-reverse modulation

(2013) Nay Lin et al.   MICROELECTRONICS RELIABILITY

Study on Cu Protrusion of Through-Silicon Via

(2013) F. X. Che et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique

(2012) Suk-Kyu Ryu et al.   APPLIED PHYSICS LETTERS

Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing

(2012) Hae-A-Seul Shin et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication

(2012) A. Heryanto et al.   JOURNAL OF ELECTRONIC MATERIALS

Fracture Properties of SPS Tungsten Copper Powder Composites

(2012) Medhat Awad El-Hadek et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test

(2012) Xi Liu et al.   MICROELECTRONICS RELIABILITY

Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy

(2012) K.N. Tu et al.   MICROELECTRONICS RELIABILITY

Effect of Process Parameters on TSV Formation Using Deep Reactive Ion Etching

(2011) Kwang-Seok Kim et al.   Korean Journal of Metals and Materials

CMP process development for the via-middle 3D TSV applications at 28nm technology node

(2011) T.C. Tsai et al.   MICROELECTRONIC ENGINEERING

3D-interconnect: Visualization of extrusion and voids induced in copper-filled through-silicon vias (TSVs) at various temperatures using X-ray microscopy

(2011) LayWai Kong et al.   MICROELECTRONIC ENGINEERING

Reduction of defects in TSV filled with Cu by high-speed 3-step PPR for 3D Si chip stacking

(2011) Sung Chul Hong et al.   MICROELECTRONICS RELIABILITY

Cu pumping in TSVs: Effect of pre-CMP thermal budget

(2011) I. De Wolf et al.   MICROELECTRONICS RELIABILITY

Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits

(2011) A.S. Budiman et al.   MICROELECTRONICS RELIABILITY

Carbon-Nanotube Through-Silicon Via Interconnects for Three-Dimensional Integration

(2011) Teng Wang et al.   Small

Characterization of nanocrystalline Co–W coatings on Cu substrate, electrodeposited from a citrate-ammonia bath

(2011) Z. Ghaferi et al.   SURFACE & COATINGS TECHNOLOGY

Thermal Expansion of Ni–W, Ni–Cr, and Ni–Cr–W Alloys Between Room Temperature and 800 °C

(2009) G. A. Dosovitskiy et al.   INTERNATIONAL JOURNAL OF THERMOPHYSICS

Through-Silicon Via (TSV)

(2009) Makoto Motoyoshi   PROCEEDINGS OF THE IEEE