Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits

Published 2014 View Full Article

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Title
Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits
Authors
Keywords
-
Journal
JOURNAL OF ELECTRONIC PACKAGING
Volume 136, Issue 2, Pages 024001
Publisher
ASME International
Online
2014-03-14
DOI
10.1115/1.4027175

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