Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling
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Title
Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling
Authors
Keywords
Intermetallic compounds (IMC), solder joint, cooling rate, solidification, adsorption
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 44, Issue 1, Pages 590-596
Publisher
Springer Nature
Online
2014-12-02
DOI
10.1007/s11664-014-3530-6
References
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