Investigation of soldering process and interfacial microstructure evolution for the formation of full Cu3Sn joints in electronic packaging

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Title
Investigation of soldering process and interfacial microstructure evolution for the formation of full Cu3Sn joints in electronic packaging
Authors
Keywords
Electronic packaging, Full Cu, 3, Sn joints, Soldering temperature, Soldering pressure, Soldering time, Interfacial microstructure evolution
Journal
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
Volume 58, Issue -, Pages 39-50
Publisher
Elsevier BV
Online
2016-11-16
DOI
10.1016/j.mssp.2016.11.019

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