Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 μm diameter

Published 2016 View Full Article

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Title
Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 μm diameter
Authors
Keywords
Solder pillar, Intermetallic compounds, Diffusion mechanism, Surface diffusion
Journal
ACTA MATERIALIA
Volume 117, Issue -, Pages 146-152
Publisher
Elsevier BV
Online
2016-07-17
DOI
10.1016/j.actamat.2016.07.004

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